Intel Xeon w7-2475X contra AMD Ryzen Embedded V3C18I. Especificaciones, rendimiento, pruebas

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Serie
  Intel Xeon W AMD Ryzen Embedded V
• Grupo CPU
  Intel Xeon W-2400 AMD Ryzen Embedded V3000
• Segmento
  Desktop / Server Desktop / Server
• Generación
  12 3
• Modelo anterior
  Intel Xeon W-2275 AMD Ryzen Embedded V2718

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  20 / 40 8 / 16
• Arquitectura del núcleo
  normal normal
• Núcleos
  20x 8x Zen 3
• Hyperthreading / SMT
  Sí Sí
• Overclocking
  Sí No
• Frecuencia
  2.60 GHz 1.90 GHz
• Turbo Frequency (1 Core)
  4.80 GHz 3.80 GHz

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nombre de la GPU
  sin iGPU sin iGPU
• GPU (Turbo)
  sin turbo sin turbo

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  No No
• h265 / HEVC (10 bit)
  No No
• h264
  No No
• VP8
  No No
• VP9
  No No
• AV1
  No No
• AVC
  No No
• VC-1
  No No
• JPEG
  No No

Overview of the types and quantities of RAM supported by AMD Ryzen Embedded V3C18I y Intel Xeon w7-2475X. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo de memoria
  DDR5-4800 DDR5-4800
• Max. Memoria
  2048 GB 64 GB
• Canales de memoria
  4 (Quad Channel) 2 (Dual Channel)
• Bandwidth
  153.6 GB/s 76.8 GB/s
• ECC
  Sí Sí
• PCIe
  5.0 x 64 4.0 x 20
• AES-NI
  Sí Sí

Analyze the TDP (Thermal Design Power) requirements of Intel Xeon w7-2475X y AMD Ryzen Embedded V3C18I to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP up
  270 W 25 W
• TDP down
  -- 10 W
• Temperatura máxima
  94 °C 105 °C

Information on architecture, interfaces, and additional instructions supported by Intel Xeon w7-2475X y AMD Ryzen Embedded V3C18I, including virtual machine technologies and fabrication processes.

• Proceso técnico
  10 nm 6 nm
• Chip design
  Monolithic Chiplet
• Enchufe
  LGA 4677 FP7r2
• L2-Cache
  -- 4.00 MB
• L3-Cache
  37.50 MB 16.00 MB
• Arquitectura
  Sapphire Rapids-WS Rembrandt (Zen 3+)
• Operating systems
  Windows 11, Windows Server, Linux Windows 10, Windows 11, Linux
• Virtualización
  VT-x, VT-x EPT, VT-d, VT-rp, vPro Enterprise AMD-V, SVM
• Juego de instrucciones (ISA)
  x86-64 (64 bit) x86-64 (64 bit)
• Extensiones ISA
  SSE4.1, SSE4.2, AVX2, AVX-512, AMX SSE4a, SSE4.1, SSE4.2, AVX2, FMA3
• Fecha de publicación
  Q1/2023 Q3/2022
• Release price
  1789 $ --
• especificación
  Technical data sheet Technical data sheet