HiSilicon Kirin 970 kontra Qualcomm Snapdragon 750G. Specyfikacje, wydajność, testy

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Seria
  HiSilicon Kirin Qualcomm Snapdragon
• Pokolenie
  6 3
• Grupa CPU
  HiSilicon Kirin 970 Qualcomm Snapdragon 750

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Częstotliwość
  1.84 GHz 1.80 GHz
• Turbo (1 rdzeń)
  2.40 GHz 2.20 GHz
• Turbo (8 Cores)
  2.40 GHz 2.20 GHz
• Hyperthreading
  Nie Nie
• Overclocking
  Nie Nie
• Architektura podstawowa
  hybrid (big.LITTLE) hybrid (big.LITTLE)

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nazwa procesora graficznego
  ARM Mali-G72 MP12 Qualcomm Adreno 619
• GPU frequency
  0.75 GHz 0.95 GHz
• GPU (Turbo)
  No turbo No turbo
• Jednostki wykonawcze
  12 Shadow of the Tomb Raider has a built-in benchmark, bSilnik ten obsługuje realistyczne wyświetlanie postaci i otoczenia.
• Shader
  192 128
• Max. GPU Memory
  2 GB 4 GB
• Max. displays
  1 2
• Pokolenie
  Bifrost 2 6
• Proces technologiczny
  16 nm 8 nm
• Data wydania
  Q3/2017 Q2/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode / Encode Decode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode
• VP8
  Decode / Encode Decode
• AV1
  Nie Nie
• AVC
  Decode / Encode Decode
• VC-1
  Decode / Encode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 750G oraz HiSilicon Kirin 970. The supported memory frequencies may vary depending on the motherboard configuration.

• Typ pamięci
  LPDDR4X-2133 LPDDR4X-2133
• Max. Pamięć
  8 GB 8 GB
• ECC
  Nie Nie
• Kanały pamięci
  4 2

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 970 oraz Qualcomm Snapdragon 750G to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  9 W

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 970 oraz Qualcomm Snapdragon 750G, including virtual machine technologies and fabrication processes.

• Zestaw instrukcji (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Wirtualizacja
  None None
• L3-Cache
  2.00 MB --
• Architektura
  Cortex-A73 / Cortex-A53 Kryo 570
• Proces technologiczny
  10 nm 8 nm
• Gniazdo
  N/A N/A
• Data wydania
  Q3/2017 Q4/2020
• Part Number
  -- SM7225