HiSilicon Kirin 970 versus Qualcomm Snapdragon 750G. Especificações, desempenho, testes

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segmento
  Mobile Mobile
• Série
  HiSilicon Kirin Qualcomm Snapdragon
• Geração
  6 3
• Grupo CPU
  HiSilicon Kirin 970 Qualcomm Snapdragon 750

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frequência
  1.84 GHz 1.80 GHz
• Turbo (1 núcleo)
  2.40 GHz 2.20 GHz
• Turbo (8 Cores)
  2.40 GHz 2.20 GHz
• Hyperthreading
  Não Não
• Overclocking
  Não Não
• Arquitectura central
  hybrid (big.LITTLE) hybrid (big.LITTLE)

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nome da GPU
  ARM Mali-G72 MP12 Qualcomm Adreno 619
• GPU frequency
  0.75 GHz 0.95 GHz
• GPU (Turbo)
  Sem turbo Sem turbo
• Unidades de execução
  12 0
• Shader
  192 128
• Max. GPU Memory
  2 GB 4 GB
• Max. displays
  1 2
• Geração
  Bifrost 2 6
• Processo técnico
  16 nm 8 nm
• Data de lançamento
  Q3/2017 Q2/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode / Encode Decode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode
• VP8
  Decode / Encode Decode
• AV1
  Não Não
• AVC
  Decode / Encode Decode
• VC-1
  Decode / Encode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 750G e HiSilicon Kirin 970. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo de memória
  LPDDR4X-2133 LPDDR4X-2133
• Máx. Memória
  8 GB 8 GB
• ECC
  Não Não
• Canais de memória
  4 2

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 970 e Qualcomm Snapdragon 750G to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  9 W

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 970 e Qualcomm Snapdragon 750G, including virtual machine technologies and fabrication processes.

• Conjunto de instruções (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualização
  None None
• Кеш L3
  2.00 MB --
• Arquitectura
  Cortex-A73 / Cortex-A53 Kryo 570
• Processo técnico
  10 nm 8 nm
• Socket
  N/A N/A
• Data de lançamento
  Q3/2017 Q4/2020
• Part Number
  -- SM7225