HiSilicon Kirin 970 contro Qualcomm Snapdragon 750G. Specifiche, prestazioni, test

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segmento
  Mobile Mobile
• Serie
  HiSilicon Kirin Qualcomm Snapdragon
• Generazione
  6 3
• Gruppo CPU
  HiSilicon Kirin 970 Qualcomm Snapdragon 750

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frequenza
  1.84 GHz 1.80 GHz
• Turbo (1 Core)
  2.40 GHz 2.20 GHz
• Turbo (8 Cores)
  2.40 GHz 2.20 GHz
• Hyperthreading
  No No
• Overclock
  No No
• Architettura di base
  hybrid (big.LITTLE) hybrid (big.LITTLE)

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nome della GPU
  ARM Mali-G72 MP12 Qualcomm Adreno 619
• GPU frequency
  0.75 GHz 0.95 GHz
• GPU (Turbo)
  No turbo No turbo
• Unità di esecuzione
  12 0
• Shader
  192 128
• Max. GPU Memory
  2 GB 4 GB
• Max. displays
  1 2
• Generazione
  Bifrost 2 6
• Processo tecnico
  16 nm 8 nm
• Data di rilascio
  Q3/2017 Q2/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode / Encode Decode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode
• VP8
  Decode / Encode Decode
• AV1
  No No
• AVC
  Decode / Encode Decode
• VC-1
  Decode / Encode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 750G e HiSilicon Kirin 970. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo di memoria
  LPDDR4X-2133 LPDDR4X-2133
• Max. Memoria
  8 GB 8 GB
• ECC
  No No
• Canali di memoria
  4 2

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 970 e Qualcomm Snapdragon 750G to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  9 W

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 970 e Qualcomm Snapdragon 750G, including virtual machine technologies and fabrication processes.

• Set di istruzioni (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualizzazione
  None None
• L3-Cache
  2.00 MB --
• Architettura
  Cortex-A73 / Cortex-A53 Kryo 570
• Processo tecnico
  10 nm 8 nm
• Presa
  N/A N/A
• Data di rilascio
  Q3/2017 Q4/2020
• Part Number
  -- SM7225