HiSilicon Kirin 970 kontra HiSilicon Kirin 710. Specyfikacje, wydajność, testy

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Seria
  HiSilicon Kirin HiSilicon Kirin
• Pokolenie
  6 5
• Grupa CPU
  HiSilicon Kirin 970 HiSilicon Kirin 710

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Częstotliwość
  1.84 GHz 1.70 GHz
• Rdzenie CPU
  8 8
• Turbo (1 rdzeń)
  2.40 GHz 2.20 GHz
• CPU Threads
  8 8
• Turbo (8 Cores)
  2.40 GHz 2.20 GHz
• Hyperthreading
  Nie Nie
• Overclocking
  Nie Nie
• Architektura podstawowa
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A core
  4x Cortex-A73 4x Cortex-A73
• B core
  4x Cortex-A53 4x Cortex-A53

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nazwa procesora graficznego
  ARM Mali-G72 MP12 ARM Mali-G51 MP4
• GPU frequency
  0.75 GHz 0.65 GHz
• GPU (Turbo)
  No turbo 1.00 GHz
• Jednostki wykonawcze
  12 8
• Shader
  192 128
• Max. GPU Memory
  2 GB 4 GB
• Max. displays
  1 2
• Pokolenie
  Bifrost 2 Bifrost 1
• DirectX Version
  12 11
• Proces technologiczny
  16 nm 12 nm
• Data wydania
  Q3/2017 Q2/2018

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Nie
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• AV1
  Nie Nie
• AVC
  Decode / Encode Decode / Encode
• VC-1
  Decode / Encode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 710 oraz HiSilicon Kirin 970. The supported memory frequencies may vary depending on the motherboard configuration.

• Typ pamięci
  LPDDR4X-2133 LPDDR3LPDDR4
• Max. Pamięć
  8 GB 6 GB
• ECC
  Nie Nie
• Kanały pamięci
  4 2

• AES-NI
  Nie Nie

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 970 oraz HiSilicon Kirin 710 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  9 W 5 W

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 970 oraz HiSilicon Kirin 710, including virtual machine technologies and fabrication processes.

• Zestaw instrukcji (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Wirtualizacja
  None None
• L3-Cache
  2.00 MB 1.00 MB
• Architektura
  Cortex-A73 / Cortex-A53 Cortex-A73 / Cortex-A53
• Proces technologiczny
  10 nm 12 nm
• Gniazdo
  N/A N/A
• Data wydania
  Q3/2017 Q3/2018