Samsung Exynos 7580 contro HiSilicon Kirin 650. Specifiche, prestazioni, test

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Serie
  Samsung Exynos HiSilicon Kirin
• Gruppo CPU
  Samsung Exynos 7578/7580 HiSilicon Kirin 650
• Segmento
  Mobile Mobile
• Generazione
  1 4

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Architettura di base
  normal hybrid (big.LITTLE)
• Frequenza
  1.60 GHz 1.70 GHz
• Turbo (1 Core)
  1.60 GHz 2.00 GHz
• Turbo (8 Cores)
  1.60 GHz 2.00 GHz
• Hyperthreading
  No No
• Overclock
  No No

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nome della GPU
  ARM Mali-T720 MP2 ARM Mali-T830 MP2
• GPU frequency
  0.65 GHz 0.90 GHz
• GPU (Turbo)
  0.65 GHz 0.90 GHz
• Unità di esecuzione
  2 2
• Shader
  32 32
• Max. displays
  2 2
• Generazione
  Midgard 3 Midgard 4
• Processo tecnico
  28nm 28nm
• Data di rilascio
  Q4/2013 Q4/2015

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  No Decode / Encode
• h265 / HEVC (10 bit)
  No Decode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  No No
• AV1
  No No
• AVC
  No No
• VC-1
  No No
• JPEG
  No Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 650 e Samsung Exynos 7580. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo di memoria
  LPDDR3-933 LPDDR3-933
• Canali di memoria
  0 2
• ECC
  No No

Analyze the TDP (Thermal Design Power) requirements of Samsung Exynos 7580 e HiSilicon Kirin 650 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Samsung Exynos 7580 e HiSilicon Kirin 650, including virtual machine technologies and fabrication processes.

• Set di istruzioni (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L2-Cache
  2.00 MB --
• Architettura
  Cortex-A53 Cortex-A53 / Cortex-A53
• Processo tecnico
  28 nm 16 nm
• Virtualizzazione
  None None
• Presa
  N/A N/A
• Data di rilascio
  Q2/2015 Q2/2016