Samsung Exynos 7580 contre HiSilicon Kirin 650. Spécifications, performances, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Série
  Samsung Exynos HiSilicon Kirin
• Groupe de CPU
  Samsung Exynos 7578/7580 HiSilicon Kirin 650
• Segment
  Mobile Mobile
• Génération
  1 4

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Architecture de base
  normal hybrid (big.LITTLE)
• Fréquence
  1.60 GHz 1.70 GHz
• Turbo (1 cœur)
  1.60 GHz 2.00 GHz
• Turbo (8 Cores)
  1.60 GHz 2.00 GHz
• Hyperthreading
  Non Non
• Overclocking
  Non Non

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nom du GPU
  ARM Mali-T720 MP2 ARM Mali-T830 MP2
• GPU frequency
  0.65 GHz 0.90 GHz
• GPU (Turbo)
  0.65 GHz 0.90 GHz
• Unités d'exécution
  2 2
• Shader
  32 32
• Max. displays
  2 2
• Génération
  Midgard 3 Midgard 4
• Processus technologique
  28nm 28nm
• Date de sortie
  Q4/2013 Q4/2015

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Non Decode / Encode
• h265 / HEVC (10 bit)
  Non Decode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Non Non
• AV1
  Non Non
• AVC
  Non Non
• VC-1
  Non Non
• JPEG
  Non Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 650 et Samsung Exynos 7580. The supported memory frequencies may vary depending on the motherboard configuration.

• Type de mémoire
  LPDDR3-933 LPDDR3-933
• Canaux de mémoire
  Geekbench 5 SC is a popular cross-platform performance test for desktnt la mémoire du système. 2
• ECC
  Non Non

Analyze the TDP (Thermal Design Power) requirements of Samsung Exynos 7580 et HiSilicon Kirin 650 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Samsung Exynos 7580 et HiSilicon Kirin 650, including virtual machine technologies and fabrication processes.

• Jeu d'instructions (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L2-Cache
  2.00 MB --
• Architecture
  Cortex-A53 Cortex-A53 / Cortex-A53
• Processus technologique
  28 nm 16 nm
• Virtualization
  None None
• Socket
  N/A N/A
• Date de sortie
  Q2/2015 Q2/2016