Samsung Exynos 7580 gegen HiSilicon Kirin 650. Spezifikationen, Leistung, Tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Serie
  Samsung Exynos HiSilicon Kirin
• CPU Gruppe
  Samsung Exynos 7578/7580 HiSilicon Kirin 650
• Segment
  Mobile Mobile
• Generation
  1 4

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Zentrale Architektur
  normal hybrid (big.LITTLE)
• Frequenz
  1.60 GHz 1.70 GHz
• Turbo (1 Kern)
  1.60 GHz 2.00 GHz
• Turbo (8 Cores)
  1.60 GHz 2.00 GHz
• Hyperthreading
  Nein Nein
• Übertaktung
  Nein Nein

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU-Name
  ARM Mali-T720 MP2 ARM Mali-T830 MP2
• GPU frequency
  0.65 GHz 0.90 GHz
• GPU (Turbo)
  0.65 GHz 0.90 GHz
• Ausführungseinheiten
  2 2
• Shader
  32 32
• Max. displays
  2 2
• Generation
  Midgard 3 Midgard 4
• technisches verfahren
  28nm 28nm
• Datum der Veröffentlichung
  Q4/2013 Q4/2015

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Nein Decode / Encode
• h265 / HEVC (10 bit)
  Nein Decode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Nein Nein
• AV1
  Nein Nein
• AVC
  Nein Nein
• VC-1
  Nein Nein
• JPEG
  Nein Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 650 und Samsung Exynos 7580. The supported memory frequencies may vary depending on the motherboard configuration.

• Speicher Typ
  LPDDR3-933 LPDDR3-933
• Speicherkanäle
  0 2
• ECC
  Nein Nein

Analyze the TDP (Thermal Design Power) requirements of Samsung Exynos 7580 und HiSilicon Kirin 650 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Samsung Exynos 7580 und HiSilicon Kirin 650, including virtual machine technologies and fabrication processes.

• Befehlssatz (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L2-Cache
  2.00 MB --
• Architektur
  Cortex-A53 Cortex-A53 / Cortex-A53
• technisches verfahren
  28 nm 16 nm
• Virtualisierung
  None None
• Steckdose
  N/A N/A
• Datum der Veröffentlichung
  Q2/2015 Q2/2016