MediaTek Helio G35 contro MediaTek Helio G70. Specifiche, prestazioni, test

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segmento
  Mobile Mobile
• Serie
  Mediatek Helio Mediatek Helio
• Generazione
  1 1
• Gruppo CPU
  MediaTek Helio G25/G35 MediaTek Helio G70/G80

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frequenza
  1.80 GHz 1.70 GHz
• Core della CPU
  8 8
• Turbo (1 Core)
  2.30 GHz 2.00 GHz
• Threads della CPU
  8 8
• Turbo (8 Cores)
  1.80 GHz 1.70 GHz
• Hyperthreading
  No No
• Overclock
  No No
• Architettura di base
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A core
  4x Cortex-A53 2x Cortex-A75
• B core
  4x Cortex-A53 6x Cortex-A55

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nome della GPU
  PowerVR GE8320 ARM Mali-G52 MP2
• GPU frequency
  0.68 GHz 0.82 GHz
• GPU (Turbo)
  No turbo No turbo
• Unità di esecuzione
  1 2
• Shader
  -- 32
• Max. displays
  1 2
• Generazione
  -- Bifrost 2
• DirectX Version
  10 12
• Processo tecnico
  20 nm 16 nm
• Data di rilascio
  Q1/2017 Q3/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  No Decode / Encode
• h265 / HEVC (10 bit)
  No Decode / Encode
• h264
  No Decode / Encode
• VP9
  No Decode / Encode
• VP8
  No Decode / Encode
• AV1
  No No
• AVC
  No Decode / Encode
• VC-1
  No Decode / Encode
• JPEG
  No Decode / Encode

Overview of the types and quantities of RAM supported by MediaTek Helio G70 e MediaTek Helio G35. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo di memoria
  LPDDR3-933LPDDR4-1600 LPDDR4X-1800
• Max. Memoria
  6 GB 8 GB
• ECC
  No No
• Canali di memoria
  1 2

• AES-NI
  No No

Analyze the TDP (Thermal Design Power) requirements of MediaTek Helio G35 e MediaTek Helio G70 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by MediaTek Helio G35 e MediaTek Helio G70, including virtual machine technologies and fabrication processes.

• Set di istruzioni (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualizzazione
  None None
• Architettura
  Cortex-A53 / Cortex-A53 Cortex-A75 / Cortex-A55
• Processo tecnico
  12 nm 12 nm
• Presa
  N/A N/A
• Data di rilascio
  Q2/2020 Q1/2020
• Part Number
  MT6765G MT6769V/CB