MediaTek Helio G35 contre MediaTek Helio G70. Spécifications, performances, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Série
  Mediatek Helio Mediatek Helio
• Génération
  1 1
• Groupe de CPU
  MediaTek Helio G25/G35 MediaTek Helio G70/G80

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Fréquence
  1.80 GHz 1.70 GHz
• Cœurs de CPU
  8 8
• Turbo (1 cœur)
  2.30 GHz 2.00 GHz
• Fils de processeur
  8 8
• Turbo (8 Cores)
  1.80 GHz 1.70 GHz
• Hyperthreading
  Non Non
• Overclocking
  Non Non
• Architecture de base
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A core
  4x Cortex-A53 2x Cortex-A75
• B core
  4x Cortex-A53 6x Cortex-A55

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nom du GPU
  PowerVR GE8320 ARM Mali-G52 MP2
• GPU frequency
  0.68 GHz 0.82 GHz
• GPU (Turbo)
  Pas de turbo Pas de turbo
• Unités d'exécution
  1 2
• Shader
  -- 32
• Max. displays
  1 2
• Génération
  -- Bifrost 2
• DirectX Version
  10 12
• Processus technologique
  20 nm 16 nm
• Date de sortie
  Q1/2017 Q3/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Non Decode / Encode
• h265 / HEVC (10 bit)
  Non Decode / Encode
• h264
  Non Decode / Encode
• VP9
  Non Decode / Encode
• VP8
  Non Decode / Encode
• AV1
  Non Non
• AVC
  Non Decode / Encode
• VC-1
  Non Decode / Encode
• JPEG
  Non Decode / Encode

Overview of the types and quantities of RAM supported by MediaTek Helio G70 et MediaTek Helio G35. The supported memory frequencies may vary depending on the motherboard configuration.

• Type de mémoire
  LPDDR3-933LPDDR4-1600 LPDDR4X-1800
• Max. Mémoire
  6 GB 8 GB
• ECC
  Non Non
• Canaux de mémoire
  1 2

• AES-NI
  Non Non

Analyze the TDP (Thermal Design Power) requirements of MediaTek Helio G35 et MediaTek Helio G70 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by MediaTek Helio G35 et MediaTek Helio G70, including virtual machine technologies and fabrication processes.

• Jeu d'instructions (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualization
  None None
• Architecture
  Cortex-A53 / Cortex-A53 Cortex-A75 / Cortex-A55
• Processus technologique
  12 nm 12 nm
• Socket
  N/A N/A
• Date de sortie
  Q2/2020 Q1/2020
• Part Number
  MT6765G MT6769V/CB