MediaTek Helio G35 gegen MediaTek Helio G70. Spezifikationen, Leistung, Tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Serie
  Mediatek Helio Mediatek Helio
• Generation
  1 1
• CPU Gruppe
  MediaTek Helio G25/G35 MediaTek Helio G70/G80

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frequenz
  1.80 GHz 1.70 GHz
• CPU Kerne
  8 8
• Turbo (1 Kern)
  2.30 GHz 2.00 GHz
• CPU Threads
  8 8
• Turbo (8 Cores)
  1.80 GHz 1.70 GHz
• Hyperthreading
  Nein Nein
• Übertaktung
  Nein Nein
• Zentrale Architektur
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A core
  4x Cortex-A53 2x Cortex-A75
• B core
  4x Cortex-A53 6x Cortex-A55

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU-Name
  PowerVR GE8320 ARM Mali-G52 MP2
• GPU frequency
  0.68 GHz 0.82 GHz
• GPU (Turbo)
  kein Turbo kein Turbo
• Ausführungseinheiten
  1 2
• Shader
  -- 32
• Max. displays
  1 2
• Generation
  -- Bifrost 2
• DirectX Version
  10 12
• technisches verfahren
  20 nm 16 nm
• Datum der Veröffentlichung
  Q1/2017 Q3/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Nein Decode / Encode
• h265 / HEVC (10 bit)
  Nein Decode / Encode
• h264
  Nein Decode / Encode
• VP9
  Nein Decode / Encode
• VP8
  Nein Decode / Encode
• AV1
  Nein Nein
• AVC
  Nein Decode / Encode
• VC-1
  Nein Decode / Encode
• JPEG
  Nein Decode / Encode

Overview of the types and quantities of RAM supported by MediaTek Helio G70 und MediaTek Helio G35. The supported memory frequencies may vary depending on the motherboard configuration.

• Speicher Typ
  LPDDR3-933LPDDR4-1600 LPDDR4X-1800
• Max. Speicher
  6 GB 8 GB
• ECC
  Nein Nein
• Speicherkanäle
  1 2

• AES-NI
  Nein Nein

Analyze the TDP (Thermal Design Power) requirements of MediaTek Helio G35 und MediaTek Helio G70 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by MediaTek Helio G35 und MediaTek Helio G70, including virtual machine technologies and fabrication processes.

• Befehlssatz (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualisierung
  None None
• Architektur
  Cortex-A53 / Cortex-A53 Cortex-A75 / Cortex-A55
• technisches verfahren
  12 nm 12 nm
• Steckdose
  N/A N/A
• Datum der Veröffentlichung
  Q2/2020 Q1/2020
• Part Number
  MT6765G MT6769V/CB