MediaTek Helio G35 contra MediaTek Helio G70. Especificaciones, rendimiento, pruebas

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segmento
  Mobile Mobile
• Serie
  Mediatek Helio Mediatek Helio
• Generación
  1 1
• Grupo CPU
  MediaTek Helio G25/G35 MediaTek Helio G70/G80

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frecuencia
  1.80 GHz 1.70 GHz
• Núcleos de CPU
  8 8
• Turbo (1 núcleo)
  2.30 GHz 2.00 GHz
• Hilos de la CPU
  8 8
• Turbo (8 Cores)
  1.80 GHz 1.70 GHz
• Hyperthreading
  No No
• Overclocking
  No No
• Arquitectura del núcleo
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A core
  4x Cortex-A53 2x Cortex-A75
• B core
  4x Cortex-A53 6x Cortex-A55

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nombre de la GPU
  PowerVR GE8320 ARM Mali-G52 MP2
• GPU frequency
  0.68 GHz 0.82 GHz
• GPU (Turbo)
  sin turbo sin turbo
• Unidades de ejecución
  1 2
• Shader
  -- 32
• Max. displays
  1 2
• Generación
  -- Bifrost 2
• DirectX Version
  10 12
• Proceso técnico
  20 nm 16 nm
• Fecha de publicación
  Q1/2017 Q3/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  No Decode / Encode
• h265 / HEVC (10 bit)
  No Decode / Encode
• h264
  No Decode / Encode
• VP9
  No Decode / Encode
• VP8
  No Decode / Encode
• AV1
  No No
• AVC
  No Decode / Encode
• VC-1
  No Decode / Encode
• JPEG
  No Decode / Encode

Overview of the types and quantities of RAM supported by MediaTek Helio G70 y MediaTek Helio G35. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo de memoria
  LPDDR3-933LPDDR4-1600 LPDDR4X-1800
• Max. Memoria
  6 GB 8 GB
• ECC
  No No
• Canales de memoria
  1 2

• AES-NI
  No No

Analyze the TDP (Thermal Design Power) requirements of MediaTek Helio G35 y MediaTek Helio G70 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by MediaTek Helio G35 y MediaTek Helio G70, including virtual machine technologies and fabrication processes.

• Juego de instrucciones (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualización
  None None
• Arquitectura
  Cortex-A53 / Cortex-A53 Cortex-A75 / Cortex-A55
• Proceso técnico
  12 nm 12 nm
• Enchufe
  N/A N/A
• Fecha de publicación
  Q2/2020 Q1/2020
• Part Number
  MT6765G MT6769V/CB