Qualcomm Snapdragon 808 contra Qualcomm Snapdragon 617. Especificaciones, rendimiento, pruebas

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Serie
  Qualcomm Snapdragon Qualcomm Snapdragon
• Grupo CPU
  Qualcomm Snapdragon 808/810 Qualcomm Snapdragon 610
• Segmento
  Mobile Mobile
• Generación
  2 2

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  6 / 6 8 / 8
• Arquitectura del núcleo
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A-Core
  2x Cortex-A57 4x Cortex-A53
• B-Core
  4x Cortex-A53 4x Cortex-A53
• Frecuencia
  1.44 GHz 1.20 GHz
• Turbo (1 núcleo)
  1.82 GHz 1.50 GHz
• Hyperthreading
  No No
• Overclocking
  No No

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nombre de la GPU
  Qualcomm Adreno 418 Qualcomm Adreno 405
• GPU frequency
  0.60 GHz 0.55 GHz
• GPU (Turbo)
  0.60 GHz 0.55 GHz
• Shader
  128 48
• Generación
  4 4
• Direct X
  11 11
• Proceso técnico
  20 nm 28 nm
• Fecha de publicación
  Q2/2014 Q1/2014

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode
• h265 / HEVC (10 bit)
  No No
• h264
  Decode / Encode Decode / Encode
• VP8
  No No
• VP9
  No No
• AV1
  No No
• AVC
  No No
• VC-1
  Decode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 617 y Qualcomm Snapdragon 808. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo de memoria
  LPDDR3-933 LPDDR3-933
• Canales de memoria
  2 1
• ECC
  No No
• AES-NI
  No No

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 808 y Qualcomm Snapdragon 617 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 808 y Qualcomm Snapdragon 617, including virtual machine technologies and fabrication processes.

• Juego de instrucciones (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Arquitectura
  Cortex-A57 / Cortex-A53 Cortex-A53
• Proceso técnico
  20 nm 28 nm
• Virtualización
  None None
• Enchufe
  N/A N/A
• Fecha de publicación
  Q3/2014 Q4/2015
• Part Number
  MSM8992 MSM8952