Qualcomm Snapdragon 808 对 Qualcomm Snapdragon 617. 规格、性能、测试

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 系列
  Qualcomm Snapdragon Qualcomm Snapdragon
• CPU组
  Qualcomm Snapdragon 808/810 Qualcomm Snapdragon 610
• 分段
  Mobile Mobile
• 一代人
  2 2

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  6 / 6 8 / 8
• 核心架构
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A-Core
  2x Cortex-A57 4x Cortex-A53
• B-Core
  4x Cortex-A53 4x Cortex-A53
• 頻率
  1.44 GHz 1.20 GHz
• 涡轮增压 (1核)
  1.82 GHz 1.50 GHz
• 超线程
  没有 没有
• 超频
  没有 没有

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名称
  Qualcomm Adreno 418 Qualcomm Adreno 405
• GPU frequency
  0.60 GHz 0.55 GHz
• GPU (Turbo)
  0.60 GHz 0.55 GHz
• 着色器
  128 48
• 一代人
  4 4
• Direct X
  11 11
• 技术过程
  20 nm 28 nm
• 发布日期
  Q2/2014 Q1/2014

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode
• h265 / HEVC (10 bit)
  没有 没有
• h264
  Decode / Encode Decode / Encode
• VP8
  没有 没有
• VP9
  没有 没有
• AV1
  没有 没有
• AVC
  没有 没有
• VC-1
  Decode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 617 和 Qualcomm Snapdragon 808. The supported memory frequencies may vary depending on the motherboard configuration.

• 存储器类型
  LPDDR3-933 LPDDR3-933
• 记忆通道
  2 1
• ECC
  没有 没有
• AES-NI
  没有 没有

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 808 和 Qualcomm Snapdragon 617 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 808 和 Qualcomm Snapdragon 617, including virtual machine technologies and fabrication processes.

• 指令集（ISA）
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• 建筑学
  Cortex-A57 / Cortex-A53 Cortex-A53
• 技术过程
  20 nm 28 nm
• 虚拟化
  None None
• 插座
  N/A N/A
• 发布日期
  Q3/2014 Q4/2015
• Part Number
  MSM8992 MSM8952