HiSilicon Kirin 650 contra Qualcomm Snapdragon 808. Especificaciones, rendimiento, pruebas

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segmento
  Mobile Mobile
• Serie
  HiSilicon Kirin Qualcomm Snapdragon
• Generación
  4 2
• Grupo CPU
  HiSilicon Kirin 650 Qualcomm Snapdragon 808/810

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frecuencia
  1.70 GHz 1.44 GHz
• Turbo (1 núcleo)
  2.00 GHz 1.82 GHz
• Hyperthreading
  No No
• Overclocking
  No No
• Arquitectura del núcleo
  hybrid (big.LITTLE) hybrid (big.LITTLE)

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nombre de la GPU
  ARM Mali-T830 MP2 Qualcomm Adreno 418
• GPU frequency
  0.90 GHz 0.60 GHz
• GPU (Turbo)
  0.90 GHz 0.60 GHz
• Unidades de ejecución
  2 0
• Shader
  32 128
• Max. displays
  2 0
• Generación
  Midgard 4 4
• Proceso técnico
  28nm 20 nm
• Fecha de publicación
  Q4/2015 Q2/2014

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode No
• h264
  Decode / Encode Decode / Encode
• VP9
  No No
• VP8
  Decode / Encode No
• AV1
  No No
• AVC
  No No
• VC-1
  No Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 808 y HiSilicon Kirin 650. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo de memoria
  LPDDR3-933 LPDDR3-933
• ECC
  No No
• Canales de memoria
  2 2

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 650 y Qualcomm Snapdragon 808 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 650 y Qualcomm Snapdragon 808, including virtual machine technologies and fabrication processes.

• Juego de instrucciones (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualización
  None None
• Arquitectura
  Cortex-A53 / Cortex-A53 Cortex-A57 / Cortex-A53
• Proceso técnico
  16 nm 20 nm
• Enchufe
  N/A N/A
• Fecha de publicación
  Q2/2016 Q3/2014
• Part Number
  -- MSM8992