Qualcomm Snapdragon 808 対 Qualcomm Snapdragon 617. 仕様・性能・テスト

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• シリーズ
  Qualcomm Snapdragon Qualcomm Snapdragon
• CPUグループ
  Qualcomm Snapdragon 808/810 Qualcomm Snapdragon 610
• セグメント
  Mobile Mobile
• 世代
  2 2

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  6 / 6 8 / 8
• コア・アーキテクチャ
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A-Core
  2x Cortex-A57 4x Cortex-A53
• B-Core
  4x Cortex-A53 4x Cortex-A53
• 周波数
  1.44 GHz 1.20 GHz
• ターボ(1コア)
  1.82 GHz 1.50 GHz
• ハイパースレッディング
  いいえ いいえ
• オーバークロッキング
  いいえ いいえ

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名
  Qualcomm Adreno 418 Qualcomm Adreno 405
• GPU frequency
  0.60 GHz 0.55 GHz
• GPU (Turbo)
  0.60 GHz 0.55 GHz
• シェーダー
  128 48
• 世代
  4 4
• Direct X
  11 11
• ぎじゅつてきなかだい
  20 nm 28 nm
• 発売日
  Q2/2014 Q1/2014

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode
• h265 / HEVC (10 bit)
  いいえ いいえ
• h264
  Decode / Encode Decode / Encode
• VP8
  いいえ いいえ
• VP9
  いいえ いいえ
• AV1
  いいえ いいえ
• AVC
  いいえ いいえ
• VC-1
  Decode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 617 と Qualcomm Snapdragon 808. The supported memory frequencies may vary depending on the motherboard configuration.

• メモリータイプ
  LPDDR3-933 LPDDR3-933
• メモリーチャンネル
  2 1
• ECC
  いいえ いいえ
• AES-NI
  いいえ いいえ

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 808 と Qualcomm Snapdragon 617 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 808 と Qualcomm Snapdragon 617, including virtual machine technologies and fabrication processes.

• 命令セット(ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• 建築
  Cortex-A57 / Cortex-A53 Cortex-A53
• ぎじゅつてきなかだい
  20 nm 28 nm
• 仮想化
  None None
• ソケット
  N/A N/A
• 発売日
  Q3/2014 Q4/2015
• Part Number
  MSM8992 MSM8952