Qualcomm Snapdragon 680 4G contra MediaTek Helio P22. Especificaciones, rendimiento, pruebas

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Serie
  Qualcomm Snapdragon Mediatek Helio
• Grupo CPU
  Qualcomm Snapdragon 680 Mediatek Helio P22/P35
• Segmento
  Mobile Mobile
• Generación
  6 3

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  8 / 8 8 / 8
• Arquitectura del núcleo
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A-Core
  4x Kryo 265 Gold 4x Cortex-A53
• B-Core
  4x Kryo 265 Silver 4x Cortex-A53
• Hyperthreading / SMT
  No No
• Overclocking
  No No
• A-Core Frequency
  2.40 GHz 2.00 GHz (2.00 GHz)
• B-Core Frequency
  1.80 GHz 1.50 GHz (1.50 GHz)

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nombre de la GPU
  Qualcomm Adreno 610 PowerVR GE8320
• GPU frequency
  0.65 GHz
• GPU (Turbo)
  sin turbo sin turbo
• Unidades de ejecución
  0 1
• Shader
  128 --
• Max. GPU Memory
  4 GB --
• Max. displays
  0 1
• Generación
  6 --
• Direct X
  12.1 10
• Proceso técnico
  11 nm 20 nm
• Fecha de publicación
  Q2/2019 Q1/2017

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode No
• h265 / HEVC (10 bit)
  Decode No
• h264
  Decode / Encode No
• VP8
  Decode No
• VP9
  Decode No
• AV1
  No No
• AVC
  Decode No
• VC-1
  Decode No
• JPEG
  Decode / Encode No

Overview of the types and quantities of RAM supported by MediaTek Helio P22 y Qualcomm Snapdragon 680 4G. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo de memoria
  LPDDR4X-2133 LPDDR4X-3200
• Max. Memoria
  4 GB 6 GB
• Canales de memoria
  2 2
• Bandwidth
  17.0 GB/s 12.8 GB/s
• ECC
  No No
• PCIe
  --
• AES-NI
  No No

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 680 4G y MediaTek Helio P22 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  --

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 680 4G y MediaTek Helio P22, including virtual machine technologies and fabrication processes.

• Juego de instrucciones (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Extensiones ISA
  --
• Arquitectura
  Kryo 265 Cortex-A53
• Proceso técnico
  6 nm 12 nm
• Virtualización
  None None
• Enchufe
  N/A N/A
• Fecha de publicación
  Q1/2022 Q2/2018
• Part Number
  SM6225 MT6762
• Operating systems
  Android Android