Qualcomm Snapdragon 680 4G gegen MediaTek Helio P22. Spezifikationen, Leistung, Tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Serie
  Qualcomm Snapdragon Mediatek Helio
• CPU Gruppe
  Qualcomm Snapdragon 680 Mediatek Helio P22/P35
• Segment
  Mobile Mobile
• Generation
  6 3

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  8 / 8 8 / 8
• Zentrale Architektur
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A-Core
  4x Kryo 265 Gold 4x Cortex-A53
• B-Core
  4x Kryo 265 Silver 4x Cortex-A53
• Hyperthreading / SMT
  Nein Nein
• Übertaktung
  Nein Nein
• A-Core Frequency
  2.40 GHz 2.00 GHz (2.00 GHz)
• B-Core Frequency
  1.80 GHz 1.50 GHz (1.50 GHz)

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU-Name
  Qualcomm Adreno 610 PowerVR GE8320
• GPU frequency
  0.65 GHz
• GPU (Turbo)
  kein Turbo kein Turbo
• Ausführungseinheiten
  0 1
• Shader
  128 --
• Max. GPU Memory
  4 GB --
• Max. displays
  0 1
• Generation
  6 --
• Direct X
  12.1 10
• technisches verfahren
  11 nm 20 nm
• Datum der Veröffentlichung
  Q2/2019 Q1/2017

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Nein
• h265 / HEVC (10 bit)
  Decode Nein
• h264
  Decode / Encode Nein
• VP8
  Decode Nein
• VP9
  Decode Nein
• AV1
  Nein Nein
• AVC
  Decode Nein
• VC-1
  Decode Nein
• JPEG
  Decode / Encode Nein

Overview of the types and quantities of RAM supported by MediaTek Helio P22 und Qualcomm Snapdragon 680 4G. The supported memory frequencies may vary depending on the motherboard configuration.

• Speicher Typ
  LPDDR4X-2133 LPDDR4X-3200
• Max. Speicher
  4 GB 6 GB
• Speicherkanäle
  2 2
• Bandwidth
  17.0 GB/s 12.8 GB/s
• ECC
  Nein Nein
• PCIe
  --
• AES-NI
  Nein Nein

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 680 4G und MediaTek Helio P22 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  --

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 680 4G und MediaTek Helio P22, including virtual machine technologies and fabrication processes.

• Befehlssatz (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• ISA-Erweiterungen
  --
• Architektur
  Kryo 265 Cortex-A53
• technisches verfahren
  6 nm 12 nm
• Virtualisierung
  None None
• Steckdose
  N/A N/A
• Datum der Veröffentlichung
  Q1/2022 Q2/2018
• Part Number
  SM6225 MT6762
• Operating systems
  Android Android