Qualcomm Snapdragon 680 4G vs MediaTek Helio P22. Specifications, performance, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Family
  Qualcomm Snapdragon Mediatek Helio
• CPU group
  Qualcomm Snapdragon 680 Mediatek Helio P22/P35
• Segment
  Mobile Mobile
• Generation
  6 3

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  8 / 8 8 / 8
• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A-Core
  4x Kryo 265 Gold 4x Cortex-A53
• B-Core
  4x Kryo 265 Silver 4x Cortex-A53
• Hyperthreading / SMT
  No No
• Overclocking
  No No
• A-Core Frequency
  2.40 GHz 2.00 GHz (2.00 GHz)
• B-Core Frequency
  1.80 GHz 1.50 GHz (1.50 GHz)

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU name
  Qualcomm Adreno 610 PowerVR GE8320
• GPU frequency
  0.65 GHz
• GPU (Turbo)
  No turbo No turbo
• Execution units
  0 1
• Shader
  128 --
• Max. GPU Memory
  4 GB --
• Max. displays
  0 1
• Generation
  6 --
• Direct X
  12.1 10
• Technology
  11 nm 20 nm
• Release date
  Q2/2019 Q1/2017

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode No
• h265 / HEVC (10 bit)
  Decode No
• h264
  Decode / Encode No
• VP8
  Decode No
• VP9
  Decode No
• AV1
  No No
• AVC
  Decode No
• VC-1
  Decode No
• JPEG
  Decode / Encode No

Overview of the types and quantities of RAM supported by MediaTek Helio P22 and Qualcomm Snapdragon 680 4G. The supported memory frequencies may vary depending on the motherboard configuration.

• Memory type
  LPDDR4X-2133 LPDDR4X-3200
• Max. Memory
  4 GB 6 GB
• Memory channels
  2 2
• Bandwidth
  17.0 GB/s 12.8 GB/s
• ECC
  No No
• PCIe
  --
• AES-NI
  No No

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 680 4G and MediaTek Helio P22 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  --

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 680 4G and MediaTek Helio P22, including virtual machine technologies and fabrication processes.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• ISA extensions
  --
• Architecture
  Kryo 265 Cortex-A53
• Technology
  6 nm 12 nm
• Virtualization
  None None
• Socket
  N/A N/A
• Release date
  Q1/2022 Q2/2018
• Part Number
  SM6225 MT6762
• Operating systems
  Android Android