HiSilicon Kirin 710 vs Qualcomm Snapdragon 665. Specifications, performance, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Family
  HiSilicon Kirin Qualcomm Snapdragon
• Generation
  5 7
• CPU group
  HiSilicon Kirin 710 Qualcomm Snapdragon 662/665

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frequency
  1.70 GHz 1.80 GHz
• CPU Cores
  8 8
• Turbo (1 Core)
  2.20 GHz 2.00 GHz
• CPU Threads
  8 8
• Turbo (8 Cores)
  2.20 GHz 1.80 GHz
• Hyperthreading
  No No
• Overclocking
  No No
• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A core
  4x Cortex-A73 4x Kryo 260 Gold
• B core
  4x Cortex-A53 4x Kryo 260 Silver

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU name
  ARM Mali-G51 MP4 Qualcomm Adreno 610
• GPU frequency
  0.65 GHz
• GPU (Turbo)
  1.00 GHz No turbo
• Execution units
  8 0
• Shader
  128 128
• Max. GPU Memory
  4 GB 4 GB
• Max. displays
  2 0
• Generation
  Bifrost 1 6
• DirectX Version
  11 12.1
• Technology
  12 nm 11 nm
• Release date
  Q2/2018 Q2/2019

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  No Decode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode
• VP8
  Decode / Encode Decode
• AV1
  No No
• AVC
  Decode / Encode Decode
• VC-1
  Decode / Encode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 665 and HiSilicon Kirin 710. The supported memory frequencies may vary depending on the motherboard configuration.

• Memory type
  LPDDR3LPDDR4 LPDDR3-1866LPDDR4X-1866
• Max. Memory
  6 GB
• ECC
  No No
• Memory channels
  2 2

• AES-NI
  No No

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 710 and Qualcomm Snapdragon 665 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  5 W

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 710 and Qualcomm Snapdragon 665, including virtual machine technologies and fabrication processes.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualization
  None None
• L3-Cache
  1.00 MB --
• Architecture
  Cortex-A73 / Cortex-A53 Kryo 260
• Technology
  12 nm 11 nm
• Socket
  N/A N/A
• Release date
  Q3/2018 Q2/2019
• Part Number
  -- SM6125