Apple A8X contra HiSilicon Kirin 930. Especificaciones, rendimiento, pruebas

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segmento
  Mobile Mobile
• Serie
  Apple A series HiSilicon Kirin
• Generación
  8 3
• Grupo CPU
  Apple A8/A8X HiSilicon Kirin 930
• Successor
  Apple A9X --

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frecuencia
  1.50 GHz 1.50 GHz
• Núcleos de CPU
  3 8
• Turbo (1 núcleo)
  sin turbo 2.00 GHz
• Hilos de la CPU
  3 8
• Hyperthreading
  No No
• Overclocking
  No No
• Arquitectura del núcleo
  normal hybrid (big.LITTLE)
• A core
  3x Typhoon 4x Cortex-A53
• B core
  -- 4x Cortex-A53

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nombre de la GPU
  Apple A8X ARM Mali-T628 MP4
• GPU frequency
  0.45 GHz 0.60 GHz
• GPU (Turbo)
  sin turbo 0.60 GHz
• Unidades de ejecución
  8 4
• Shader
  256 64
• Max. GPU Memory
  4 GB --
• Max. displays
  1 1
• Generación
  5 Midgard 2
• DirectX Version
  11
• Proceso técnico
  20 nm 32nm
• Fecha de publicación
  Q3/2014 Q4/2012

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  No No
• h265 / HEVC (10 bit)
  No No
• h264
  Decode Decode / Encode
• VP9
  No No
• VP8
  No Decode / Encode
• AV1
  No No
• AVC
  Decode No
• VC-1
  Decode No
• JPEG
  Decode / Encode No

Overview of the types and quantities of RAM supported by HiSilicon Kirin 930 y Apple A8X. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo de memoria
  LPDDR3-1600 LPDDR3-1600
• Max. Memoria
  4 GB
• ECC
  No No
• Canales de memoria
  2 2

• AES-NI
  No No

Analyze the TDP (Thermal Design Power) requirements of Apple A8X y HiSilicon Kirin 930 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  8 W

Information on architecture, interfaces, and additional instructions supported by Apple A8X y HiSilicon Kirin 930, including virtual machine technologies and fabrication processes.

• Juego de instrucciones (ISA)
  x86-64 (64 bit) ARMv8-A64 (64 bit)
• Virtualización
  None None
• L2-Cache
  2.00 MB --
• L3-Cache
  4.00 MB --
• Arquitectura
  A8 Cortex-A53 / Cortex-A53
• Proceso técnico
  20 nm 28 nm
• Enchufe
  N/A N/A
• Fecha de publicación
  Q3/2014 Q1/2015