Apple A8X gegen HiSilicon Kirin 930. Spezifikationen, Leistung, Tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Serie
  Apple A series HiSilicon Kirin
• Generation
  8 3
• CPU Gruppe
  Apple A8/A8X HiSilicon Kirin 930
• Successor
  Apple A9X --

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frequenz
  1.50 GHz 1.50 GHz
• CPU Kerne
  3 8
• Turbo (1 Kern)
  kein Turbo 2.00 GHz
• CPU Threads
  3 8
• Hyperthreading
  Nein Nein
• Übertaktung
  Nein Nein
• Zentrale Architektur
  normal hybrid (big.LITTLE)
• A core
  3x Typhoon 4x Cortex-A53
• B core
  -- 4x Cortex-A53

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU-Name
  Apple A8X ARM Mali-T628 MP4
• GPU frequency
  0.45 GHz 0.60 GHz
• GPU (Turbo)
  kein Turbo 0.60 GHz
• Ausführungseinheiten
  8 4
• Shader
  256 64
• Max. GPU Memory
  4 GB --
• Max. displays
  1 1
• Generation
  5 Midgard 2
• DirectX Version
  11
• technisches verfahren
  20 nm 32nm
• Datum der Veröffentlichung
  Q3/2014 Q4/2012

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Nein Nein
• h265 / HEVC (10 bit)
  Nein Nein
• h264
  Decode Decode / Encode
• VP9
  Nein Nein
• VP8
  Nein Decode / Encode
• AV1
  Nein Nein
• AVC
  Decode Nein
• VC-1
  Decode Nein
• JPEG
  Decode / Encode Nein

Overview of the types and quantities of RAM supported by HiSilicon Kirin 930 und Apple A8X. The supported memory frequencies may vary depending on the motherboard configuration.

• Speicher Typ
  LPDDR3-1600 LPDDR3-1600
• Max. Speicher
  4 GB
• ECC
  Nein Nein
• Speicherkanäle
  2 2

• AES-NI
  Nein Nein

Analyze the TDP (Thermal Design Power) requirements of Apple A8X und HiSilicon Kirin 930 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  8 W

Information on architecture, interfaces, and additional instructions supported by Apple A8X und HiSilicon Kirin 930, including virtual machine technologies and fabrication processes.

• Befehlssatz (ISA)
  x86-64 (64 bit) ARMv8-A64 (64 bit)
• Virtualisierung
  None None
• L2-Cache
  2.00 MB --
• L3-Cache
  4.00 MB --
• Architektur
  A8 Cortex-A53 / Cortex-A53
• technisches verfahren
  20 nm 28 nm
• Steckdose
  N/A N/A
• Datum der Veröffentlichung
  Q3/2014 Q1/2015