HiSilicon Kirin 950 gegen Qualcomm Snapdragon 690. Spezifikationen, Leistung, Tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Serie
  HiSilicon Kirin Qualcomm Snapdragon
• Generation
  4 8
• CPU Gruppe
  HiSilicon Kirin 950 Qualcomm Snapdragon 690

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frequenz
  1.80 GHz 1.70 GHz
• CPU Kerne
  8 8
• Turbo (1 Kern)
  2.30 GHz 2.00 GHz
• CPU Threads
  8 8
• Turbo (8 Cores)
  2.30 GHz 1.70 GHz
• Hyperthreading
  Nein Nein
• Übertaktung
  Nein Nein
• Zentrale Architektur
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A core
  4x Cortex-A72 2x Kryo 560 Gold
• B core
  4x Cortex-A53 6x Kryo 560 Silver

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU-Name
  ARM Mali-T880 MP4 Qualcomm Adreno 619L
• GPU frequency
  0.90 GHz 0.95 GHz
• GPU (Turbo)
  0.90 GHz kein Turbo
• Ausführungseinheiten
  4 0
• Shader
  64 0
• Max. displays
  2 0
• Generation
  Midgard 4 6
• DirectX Version
  11 12.1
• technisches verfahren
  16 nm 8 nm
• Datum der Veröffentlichung
  Q2/2016 Q4/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode Decode
• h264
  Decode / Encode Decode
• VP9
  Nein Decode
• VP8
  Decode / Encode Decode
• AV1
  Nein Nein
• AVC
  Nein Decode
• VC-1
  Nein Decode
• JPEG
  Decode / Encode Decode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 690 und HiSilicon Kirin 950. The supported memory frequencies may vary depending on the motherboard configuration.

• Speicher Typ
  LPDDR4 LPDDR4X-1866
• ECC
  Nein Nein
• Speicherkanäle
  2 2

• AES-NI
  Nein Nein

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 950 und Qualcomm Snapdragon 690 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 950 und Qualcomm Snapdragon 690, including virtual machine technologies and fabrication processes.

• Befehlssatz (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualisierung
  None None
• Architektur
  Cortex-A72 / Cortex-A53 Kryo 560
• technisches verfahren
  16 nm 8 nm
• Steckdose
  N/A N/A
• Datum der Veröffentlichung
  Q4/2015 Q4/2020
• Part Number
  -- SM6350