MediaTek Helio G96 gegen Qualcomm Snapdragon 690. Spezifikationen, Leistung, Tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Serie
  Mediatek Helio Qualcomm Snapdragon
• Generation
  1 8
• CPU Gruppe
  MediaTek Helio G90 Qualcomm Snapdragon 690

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frequenz
  2.00 GHz 1.70 GHz
• CPU Kerne
  8 8
• Turbo (1 Kern)
  2.05 GHz 2.00 GHz
• CPU Threads
  8 8
• Turbo (8 Cores)
  2.00 GHz 1.70 GHz
• Hyperthreading
  Nein Nein
• Übertaktung
  Nein Nein
• Zentrale Architektur
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A core
  2x Cortex-A76 2x Kryo 560 Gold
• B core
  6x Cortex-A55 6x Kryo 560 Silver

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU-Name
  ARM Mali-G57 MP2 Qualcomm Adreno 619L
• GPU frequency
  0.90 GHz 0.95 GHz
• GPU (Turbo)
  kein Turbo kein Turbo
• Ausführungseinheiten
  2 0
• Shader
  32 0
• Max. GPU Memory
  4 GB --
• Max. displays
  2 0
• Generation
  Vallhall 1 6
• DirectX Version
  12 12.1
• technisches verfahren
  7 nm 8 nm
• Datum der Veröffentlichung
  Q2/2020 Q4/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode / Encode Decode
• h264
  Decode / Encode Decode
• VP9
  Decode / Encode Decode
• VP8
  Decode / Encode Decode
• AV1
  Decode Nein
• AVC
  Decode / Encode Decode
• VC-1
  Decode / Encode Decode
• JPEG
  Decode / Encode Decode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 690 und MediaTek Helio G96. The supported memory frequencies may vary depending on the motherboard configuration.

• Speicher Typ
  LPDDR4X-2133 LPDDR4X-1866
• Max. Speicher
  10 GB
• ECC
  Nein Nein
• Speicherkanäle
  2 2
• PCIe-Version
  --
• PCIe-Lanes
  --

• AES-NI
  Nein Nein

Analyze the TDP (Thermal Design Power) requirements of MediaTek Helio G96 und Qualcomm Snapdragon 690 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  --

Information on architecture, interfaces, and additional instructions supported by MediaTek Helio G96 und Qualcomm Snapdragon 690, including virtual machine technologies and fabrication processes.

• Befehlssatz (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualisierung
  None None
• ISA-Erweiterungen
  --
• Architektur
  Cortex-A76 / Cortex-A55 Kryo 560
• technisches verfahren
  12 nm 8 nm
• Steckdose
  N/A N/A
• Datum der Veröffentlichung
  Q3/2021 Q4/2020
• Part Number
  -- SM6350