HiSilicon Kirin 950 contro Qualcomm Snapdragon 690. Specifiche, prestazioni, test

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segmento
  Mobile Mobile
• Serie
  HiSilicon Kirin Qualcomm Snapdragon
• Generazione
  4 8
• Gruppo CPU
  HiSilicon Kirin 950 Qualcomm Snapdragon 690

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frequenza
  1.80 GHz 1.70 GHz
• Core della CPU
  8 8
• Turbo (1 Core)
  2.30 GHz 2.00 GHz
• Threads della CPU
  8 8
• Turbo (8 Cores)
  2.30 GHz 1.70 GHz
• Hyperthreading
  No No
• Overclock
  No No
• Architettura di base
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A core
  4x Cortex-A72 2x Kryo 560 Gold
• B core
  4x Cortex-A53 6x Kryo 560 Silver

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nome della GPU
  ARM Mali-T880 MP4 Qualcomm Adreno 619L
• GPU frequency
  0.90 GHz 0.95 GHz
• GPU (Turbo)
  0.90 GHz No turbo
• Unità di esecuzione
  4 0
• Shader
  64 0
• Max. displays
  2 0
• Generazione
  Midgard 4 6
• DirectX Version
  11 12.1
• Processo tecnico
  16 nm 8 nm
• Data di rilascio
  Q2/2016 Q4/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode Decode
• h264
  Decode / Encode Decode
• VP9
  No Decode
• VP8
  Decode / Encode Decode
• AV1
  No No
• AVC
  No Decode
• VC-1
  No Decode
• JPEG
  Decode / Encode Decode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 690 e HiSilicon Kirin 950. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo di memoria
  LPDDR4 LPDDR4X-1866
• ECC
  No No
• Canali di memoria
  2 2

• AES-NI
  No No

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 950 e Qualcomm Snapdragon 690 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 950 e Qualcomm Snapdragon 690, including virtual machine technologies and fabrication processes.

• Set di istruzioni (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualizzazione
  None None
• Architettura
  Cortex-A72 / Cortex-A53 Kryo 560
• Processo tecnico
  16 nm 8 nm
• Presa
  N/A N/A
• Data di rilascio
  Q4/2015 Q4/2020
• Part Number
  -- SM6350