HiSilicon Kirin 950 vs Qualcomm Snapdragon 690. 사양, 성능, 테스트

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 세그먼트
  Mobile Mobile
• 가족
  HiSilicon Kirin Qualcomm Snapdragon
• 세대
  4 8
• CPU 그룹
  HiSilicon Kirin 950 Qualcomm Snapdragon 690

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• 빈도
  1.80 GHz 1.70 GHz
• CPU 코어
  8 8
• Turbo (1 Core)
  2.30 GHz 2.00 GHz
• CPU 스레드
  8 8
• Turbo (8 Cores)
  2.30 GHz 1.70 GHz
• Hyperthreading
  아니요 아니요
• 오버클러킹
  아니요 아니요
• 핵심 아키텍처
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A core
  4x Cortex-A72 2x Kryo 560 Gold
• B core
  4x Cortex-A53 6x Kryo 560 Silver

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU 이름
  ARM Mali-T880 MP4 Qualcomm Adreno 619L
• GPU frequency
  0.90 GHz 0.95 GHz
• GPU (Turbo)
  0.90 GHz 터보 없음
• 실행 단위
  4 0
• Shader
  64 0
• Max. displays
  2 0
• 세대
  Midgard 4 6
• DirectX Version
  11 12.1
• 기술
  16 nm 8 nm
• 릴리스 날짜
  Q2/2016 Q4/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode Decode
• h264
  Decode / Encode Decode
• VP9
  아니요 Decode
• VP8
  Decode / Encode Decode
• AV1
  아니요 아니요
• AVC
  아니요 Decode
• VC-1
  아니요 Decode
• JPEG
  Decode / Encode Decode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 690 그리고 HiSilicon Kirin 950. The supported memory frequencies may vary depending on the motherboard configuration.

• 메모리 유형
  LPDDR4 LPDDR4X-1866
• ECC
  아니요 아니요
• 메모리 채널
  2 2

• AES-NI
  아니요 아니요

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 950 그리고 Qualcomm Snapdragon 690 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 950 그리고 Qualcomm Snapdragon 690, including virtual machine technologies and fabrication processes.

• 명령어 세트(ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• 가상화
  None None
• 아키텍처
  Cortex-A72 / Cortex-A53 Kryo 560
• 기술
  16 nm 8 nm
• 소켓
  N/A N/A
• 릴리스 날짜
  Q4/2015 Q4/2020
• Part Number
  -- SM6350