Samsung Exynos 3475 对 Qualcomm Snapdragon 870. 规格、性能、测试

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 系列
  Samsung Exynos Qualcomm Snapdragon
• CPU组
  Samsung Exynos 3400 Qualcomm Snapdragon 865/870
• 分段
  Mobile Mobile
• 一代人
  3 7

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• 核心架构
  normal hybrid (Prime / big.LITTLE)
• 頻率
  1.30 GHz 1.80 GHz
• 涡轮增压 (1核)
  1.30 GHz 3.20 GHz
• 超线程
  没有 没有
• 超频
  没有 没有

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名称
  ARM Mali-T720 MP1 Qualcomm Adreno 650
• GPU frequency
  0.60 GHz 0.25 GHz
• GPU (Turbo)
  0.60 GHz 0.67 GHz
• 执行单位
  1 2
• 着色器
  16 512
• Max. displays
  2 1
• 一代人
  Midgard 3 6
• 技术过程
  28nm 7 nm
• 发布日期
  Q4/2013 Q4/2019

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  没有 Decode / Encode
• h265 / HEVC (10 bit)
  没有 Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  没有 Decode / Encode
• AV1
  没有 没有
• AVC
  没有 Decode
• VC-1
  没有 Decode
• JPEG
  没有 Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 870 和 Samsung Exynos 3475. The supported memory frequencies may vary depending on the motherboard configuration.

• 存储器类型
  LPDDR3-400 LPDDR4X-4266LPDDR5-5500
• 最大内存
  16 GB
• 记忆通道
  0 4
• ECC
  没有 没有

Analyze the TDP (Thermal Design Power) requirements of Samsung Exynos 3475 和 Qualcomm Snapdragon 870 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  10 W

Information on architecture, interfaces, and additional instructions supported by Samsung Exynos 3475 和 Qualcomm Snapdragon 870, including virtual machine technologies and fabrication processes.

• 指令集（ISA）
  ARMv7-A32 (32 bit) ARMv8-A64 (64 bit)
• L2-Cache
  -- 2.00 MB
• L2-Cache
  -- 3.00 MB
• 建筑学
  Cortex-A7 Kryo 585
• 技术过程
  28 nm 7 nm
• 虚拟化
  None None
• 插座
  N/A N/A
• 发布日期
  2015 Q2/2021
• Part Number
  -- SM8250-AC