Samsung Exynos 3475 対 Qualcomm Snapdragon 870. 仕様・性能・テスト

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• シリーズ
  Samsung Exynos Qualcomm Snapdragon
• CPUグループ
  Samsung Exynos 3400 Qualcomm Snapdragon 865/870
• セグメント
  Mobile Mobile
• 世代
  3 7

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• コア・アーキテクチャ
  normal hybrid (Prime / big.LITTLE)
• 周波数
  1.30 GHz 1.80 GHz
• ターボ(1コア)
  1.30 GHz 3.20 GHz
• ハイパースレッディング
  いいえ いいえ
• オーバークロッキング
  いいえ いいえ

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名
  ARM Mali-T720 MP1 Qualcomm Adreno 650
• GPU frequency
  0.60 GHz 0.25 GHz
• GPU (Turbo)
  0.60 GHz 0.67 GHz
• 実行部隊
  1 2
• シェーダー
  16 512
• Max. displays
  2 1
• 世代
  Midgard 3 6
• ぎじゅつてきなかだい
  28nm 7 nm
• 発売日
  Q4/2013 Q4/2019

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  いいえ Decode / Encode
• h265 / HEVC (10 bit)
  いいえ Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  いいえ Decode / Encode
• AV1
  いいえ いいえ
• AVC
  いいえ Decode
• VC-1
  いいえ Decode
• JPEG
  いいえ Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 870 と Samsung Exynos 3475. The supported memory frequencies may vary depending on the motherboard configuration.

• メモリータイプ
  LPDDR3-400 LPDDR4X-4266LPDDR5-5500
• マックス メモリ
  16 GB
• メモリーチャンネル
  0 4
• ECC
  いいえ いいえ

Analyze the TDP (Thermal Design Power) requirements of Samsung Exynos 3475 と Qualcomm Snapdragon 870 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  10 W

Information on architecture, interfaces, and additional instructions supported by Samsung Exynos 3475 と Qualcomm Snapdragon 870, including virtual machine technologies and fabrication processes.

• 命令セット(ISA)
  ARMv7-A32 (32 bit) ARMv8-A64 (64 bit)
• L2-Cache
  -- 2.00 MB
• L3-Cache
  -- 3.00 MB
• 建築
  Cortex-A7 Kryo 585
• ぎじゅつてきなかだい
  28 nm 7 nm
• 仮想化
  None None
• ソケット
  N/A N/A
• 発売日
  2015 Q2/2021
• Part Number
  -- SM8250-AC