Samsung Exynos 3475 kontra Qualcomm Snapdragon 870. Specyfikacje, wydajność, testy

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Seria
  Samsung Exynos Qualcomm Snapdragon
• Grupa CPU
  Samsung Exynos 3400 Qualcomm Snapdragon 865/870
• Segment
  Mobile Mobile
• Pokolenie
  3 7

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Architektura podstawowa
  normal hybrid (Prime / big.LITTLE)
• Częstotliwość
  1.30 GHz 1.80 GHz
• Turbo (1 rdzeń)
  1.30 GHz 3.20 GHz
• Hyperthreading
  Nie Nie
• Overclocking
  Nie Nie

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nazwa procesora graficznego
  ARM Mali-T720 MP1 Qualcomm Adreno 650
• GPU frequency
  0.60 GHz 0.25 GHz
• GPU (Turbo)
  0.60 GHz 0.67 GHz
• Jednostki wykonawcze
  1 2
• Shader
  16 512
• Max. displays
  2 1
• Pokolenie
  Midgard 3 6
• Proces technologiczny
  28nm 7 nm
• Data wydania
  Q4/2013 Q4/2019

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Nie Decode / Encode
• h265 / HEVC (10 bit)
  Nie Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Nie Decode / Encode
• AV1
  Nie Nie
• AVC
  Nie Decode
• VC-1
  Nie Decode
• JPEG
  Nie Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 870 oraz Samsung Exynos 3475. The supported memory frequencies may vary depending on the motherboard configuration.

• Typ pamięci
  LPDDR3-400 LPDDR4X-4266LPDDR5-5500
• Max. Pamięć
  16 GB
• Kanały pamięci
  Shadow of the Tomb Raider has a built-in benchmark, bSilnik ten obsługuje realistyczne wyświetlanie postaci i otoczenia. 4
• ECC
  Nie Nie

Analyze the TDP (Thermal Design Power) requirements of Samsung Exynos 3475 oraz Qualcomm Snapdragon 870 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  10 W

Information on architecture, interfaces, and additional instructions supported by Samsung Exynos 3475 oraz Qualcomm Snapdragon 870, including virtual machine technologies and fabrication processes.

• Zestaw instrukcji (ISA)
  ARMv7-A32 (32 bit) ARMv8-A64 (64 bit)
• L2-Cache
  -- 2.00 MB
• L3-Cache
  -- 3.00 MB
• Architektura
  Cortex-A7 Kryo 585
• Proces technologiczny
  28 nm 7 nm
• Wirtualizacja
  None None
• Gniazdo
  N/A N/A
• Data wydania
  2015 Q2/2021
• Part Number
  -- SM8250-AC