Qualcomm Snapdragon 670 对 Qualcomm Snapdragon 850. 规格、性能、测试

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 分段
  Mobile Mobile
• 系列
  Qualcomm Snapdragon Qualcomm Snapdragon
• 一代人
  6 5
• CPU组
  Qualcomm Snapdragon 670 Qualcomm Snapdragon 845

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• 頻率
  1.70 GHz 1.80 GHz
• CPU核数
  8 8
• 涡轮增压 (1核)
  2.00 GHz 2.95 GHz
• CPU线程
  8 8
• Turbo (8 Cores)
  1.70 GHz 2.95 GHz
• 超线程
  没有 没有
• 超频
  没有 没有
• 核心架构
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A core
  2x Kryo 360 Gold 4x Kryo 385 Gold
• B core
  6x Kryo 360 Silver 4x Kryo 385 Silver

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名称
  Qualcomm Adreno 615 Qualcomm Adreno 630
• GPU frequency
  0.70 GHz 0.70 GHz
• GPU (Turbo)
  0.70 GHz 没有涡轮增压
• 着色器
  256 256
• Max. GPU Memory
  -- 8 GB
• Max. displays
  0 2
• 一代人
  6 4
• DirectX Version
  12.1 11
• 技术过程
  10 nm 10 nm
• 发布日期
  Q2/2018 Q1/2018

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode
• h265 / HEVC (10 bit)
  Decode Decode
• h264
  Decode Decode / Encode
• VP9
  Decode Decode
• VP8
  Decode Decode
• AV1
  没有 没有
• AVC
  Decode Decode
• VC-1
  Decode Decode
• JPEG
  Decode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 850 和 Qualcomm Snapdragon 670. The supported memory frequencies may vary depending on the motherboard configuration.

• 存储器类型
  LPDDR4X-1866 LPDDR4X-1866
• 最大内存
  8 GB
• ECC
  没有 没有
• 记忆通道
  2 4

• AES-NI
  没有 没有

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 670 和 Qualcomm Snapdragon 850 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 670 和 Qualcomm Snapdragon 850, including virtual machine technologies and fabrication processes.

• 指令集（ISA）
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• 虚拟化
  None None
• 建筑学
  Kryo 360 Kryo 385
• 技术过程
  10 nm 10 nm
• 插座
  N/A N/A
• 发布日期
  Q3/2018 Q3/2018
• Part Number
  SDM670 SDM850