Qualcomm Snapdragon 670 contra Qualcomm Snapdragon 850. Especificaciones, rendimiento, pruebas

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segmento
  Mobile Mobile
• Serie
  Qualcomm Snapdragon Qualcomm Snapdragon
• Generación
  6 5
• Grupo CPU
  Qualcomm Snapdragon 670 Qualcomm Snapdragon 845

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frecuencia
  1.70 GHz 1.80 GHz
• Núcleos de CPU
  8 8
• Turbo (1 núcleo)
  2.00 GHz 2.95 GHz
• Hilos de la CPU
  8 8
• Turbo (8 Cores)
  1.70 GHz 2.95 GHz
• Hyperthreading
  No No
• Overclocking
  No No
• Arquitectura del núcleo
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A core
  2x Kryo 360 Gold 4x Kryo 385 Gold
• B core
  6x Kryo 360 Silver 4x Kryo 385 Silver

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nombre de la GPU
  Qualcomm Adreno 615 Qualcomm Adreno 630
• GPU frequency
  0.70 GHz 0.70 GHz
• GPU (Turbo)
  0.70 GHz sin turbo
• Shader
  256 256
• Max. GPU Memory
  -- 8 GB
• Max. displays
  0 2
• Generación
  6 4
• DirectX Version
  12.1 11
• Proceso técnico
  10 nm 10 nm
• Fecha de publicación
  Q2/2018 Q1/2018

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode
• h265 / HEVC (10 bit)
  Decode Decode
• h264
  Decode Decode / Encode
• VP9
  Decode Decode
• VP8
  Decode Decode
• AV1
  No No
• AVC
  Decode Decode
• VC-1
  Decode Decode
• JPEG
  Decode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 850 y Qualcomm Snapdragon 670. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo de memoria
  LPDDR4X-1866 LPDDR4X-1866
• Max. Memoria
  8 GB
• ECC
  No No
• Canales de memoria
  2 4

• AES-NI
  No No

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 670 y Qualcomm Snapdragon 850 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 670 y Qualcomm Snapdragon 850, including virtual machine technologies and fabrication processes.

• Juego de instrucciones (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualización
  None None
• Arquitectura
  Kryo 360 Kryo 385
• Proceso técnico
  10 nm 10 nm
• Enchufe
  N/A N/A
• Fecha de publicación
  Q3/2018 Q3/2018
• Part Number
  SDM670 SDM850