Qualcomm Snapdragon 670 versus Qualcomm Snapdragon 850. Especificações, desempenho, testes

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segmento
  Mobile Mobile
• Série
  Qualcomm Snapdragon Qualcomm Snapdragon
• Geração
  6 5
• Grupo CPU
  Qualcomm Snapdragon 670 Qualcomm Snapdragon 845

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frequência
  1.70 GHz 1.80 GHz
• Núcleos de CPU
  8 8
• Turbo (1 núcleo)
  2.00 GHz 2.95 GHz
• Roscas de CPU
  8 8
• Turbo (8 Cores)
  1.70 GHz 2.95 GHz
• Hyperthreading
  Não Não
• Overclocking
  Não Não
• Arquitectura central
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A core
  2x Kryo 360 Gold 4x Kryo 385 Gold
• B core
  6x Kryo 360 Silver 4x Kryo 385 Silver

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nome da GPU
  Qualcomm Adreno 615 Qualcomm Adreno 630
• GPU frequency
  0.70 GHz 0.70 GHz
• GPU (Turbo)
  0.70 GHz Sem turbo
• Shader
  256 256
• Max. GPU Memory
  -- 8 GB
• Max. displays
  0 2
• Geração
  6 4
• DirectX Version
  12.1 11
• Processo técnico
  10 nm 10 nm
• Data de lançamento
  Q2/2018 Q1/2018

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode
• h265 / HEVC (10 bit)
  Decode Decode
• h264
  Decode Decode / Encode
• VP9
  Decode Decode
• VP8
  Decode Decode
• AV1
  Não Não
• AVC
  Decode Decode
• VC-1
  Decode Decode
• JPEG
  Decode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 850 e Qualcomm Snapdragon 670. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo de memória
  LPDDR4X-1866 LPDDR4X-1866
• Máx. Memória
  8 GB
• ECC
  Não Não
• Canais de memória
  2 4

• AES-NI
  Não Não

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 670 e Qualcomm Snapdragon 850 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 670 e Qualcomm Snapdragon 850, including virtual machine technologies and fabrication processes.

• Conjunto de instruções (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualização
  None None
• Arquitectura
  Kryo 360 Kryo 385
• Processo técnico
  10 nm 10 nm
• Socket
  N/A N/A
• Data de lançamento
  Q3/2018 Q3/2018
• Part Number
  SDM670 SDM850