Intel Core i3-1110G4 对 Qualcomm Snapdragon 855. 规格、性能、测试

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 分段
  Mobile Mobile
• 系列
  Intel Core i3 Qualcomm Snapdragon
• 一代人
  11 6
• CPU组
  Intel Core i 1100G/11000U Qualcomm Snapdragon 855/860

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• 頻率
  1.10 GHz 1.80 GHz
• CPU核数
  4 8
• 涡轮增压 (1核)
  3.50 GHz 2.84 GHz
• CPU线程
  8 8
• 超线程
  是 没有
• 超频
  没有 没有
• 核心架构
  normal hybrid (Prime / big.LITTLE)
• A core
  -- 1x Kryo 485 Prime
• B core
  -- 3x Kryo 485 Gold
• C core
  -- 4x Kryo 485 Silver

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名称
  Intel UHD Graphics (Tiger Lake G4) Qualcomm Adreno 640
• GPU frequency
  0.30 GHz 0.25 GHz
• GPU (Turbo)
  1.10 GHz 0.59 GHz
• 执行单位
  48 4
• 着色器
  384 384
• Max. GPU Memory
  8 GB 4 GB
• Max. displays
  4 1
• 一代人
  11 5
• DirectX Version
  12 12.0
• 技术过程
  10 nm 7 nm
• 发布日期
  Q3/2020 Q1/2019

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode Decode / Encode
• VP8
  Decode Decode / Encode
• AV1
  没有 没有
• AVC
  Decode 没有
• VC-1
  Decode 没有
• JPEG
  Decode / Encode 没有

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 855 和 Intel Core i3-1110G4. The supported memory frequencies may vary depending on the motherboard configuration.

• 存储器类型
  LPDDR4X-4266 LPDDR4X-4266
• 最大内存
  32 GB 16 GB
• ECC
  没有 没有
• 记忆通道
  2 4
• PCIe版本
  4.0
• PCIe通道
  4

• AES-NI
  是 没有

Analyze the TDP (Thermal Design Power) requirements of Intel Core i3-1110G4 和 Qualcomm Snapdragon 855 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  15 W
• TDP down
  7 W --
• 最高温度
  100 °C --

Information on architecture, interfaces, and additional instructions supported by Intel Core i3-1110G4 和 Qualcomm Snapdragon 855, including virtual machine technologies and fabrication processes.

• 指令集（ISA）
  x86-64 (64 bit) ARMv8-A64 (64 bit)
• 虚拟化
  VT-x, VT-x EPT, VT-d None
• ISA扩展
  SSE4.1, SSE4.2, AVX2, AVX-512
• L2-Cache
  -- 2.00 MB
• L2-Cache
  8.00 MB 3.00 MB
• 建筑学
  Tiger Lake U Kryo 485
• 技术过程
  10 nm 7 nm
• 插座
  BGA 1526 N/A
• 发布日期
  Q1/2021 Q4/2018
• Part Number
  -- SM8150