Intel Core i3-1110G4 対 Qualcomm Snapdragon 855. 仕様・性能・テスト

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• セグメント
  Mobile Mobile
• シリーズ
  Intel Core i3 Qualcomm Snapdragon
• 世代
  11 6
• CPUグループ
  Intel Core i 1100G/11000U Qualcomm Snapdragon 855/860

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• 周波数
  1.10 GHz 1.80 GHz
• CPUコア
  4 8
• ターボ(1コア)
  3.50 GHz 2.84 GHz
• CPUスレッド
  8 8
• ハイパースレッディング
  はい いいえ
• オーバークロッキング
  いいえ いいえ
• コア・アーキテクチャ
  normal hybrid (Prime / big.LITTLE)
• A core
  -- 1x Kryo 485 Prime
• B core
  -- 3x Kryo 485 Gold
• C core
  -- 4x Kryo 485 Silver

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名
  Intel UHD Graphics (Tiger Lake G4) Qualcomm Adreno 640
• GPU frequency
  0.30 GHz 0.25 GHz
• GPU (Turbo)
  1.10 GHz 0.59 GHz
• 実行部隊
  48 4
• シェーダー
  384 384
• Max. GPU Memory
  8 GB 4 GB
• Max. displays
  4 1
• 世代
  11 5
• DirectX Version
  12 12.0
• ぎじゅつてきなかだい
  10 nm 7 nm
• 発売日
  Q3/2020 Q1/2019

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode Decode / Encode
• VP8
  Decode Decode / Encode
• AV1
  いいえ いいえ
• AVC
  Decode いいえ
• VC-1
  Decode いいえ
• JPEG
  Decode / Encode いいえ

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 855 と Intel Core i3-1110G4. The supported memory frequencies may vary depending on the motherboard configuration.

• メモリータイプ
  LPDDR4X-4266 LPDDR4X-4266
• マックス メモリ
  32 GB 16 GB
• ECC
  いいえ いいえ
• メモリーチャンネル
  2 4
• PCIe版
  4.0
• PCIeレーン
  4

• AES-NI
  はい いいえ

Analyze the TDP (Thermal Design Power) requirements of Intel Core i3-1110G4 と Qualcomm Snapdragon 855 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  15 W
• TDP down
  7 W --
• 最高温度
  100 °C --

Information on architecture, interfaces, and additional instructions supported by Intel Core i3-1110G4 と Qualcomm Snapdragon 855, including virtual machine technologies and fabrication processes.

• 命令セット(ISA)
  x86-64 (64 bit) ARMv8-A64 (64 bit)
• 仮想化
  VT-x, VT-x EPT, VT-d None
• ISAエクステンション
  SSE4.1, SSE4.2, AVX2, AVX-512
• L2-Cache
  -- 2.00 MB
• L3-Cache
  8.00 MB 3.00 MB
• 建築
  Tiger Lake U Kryo 485
• ぎじゅつてきなかだい
  10 nm 7 nm
• ソケット
  BGA 1526 N/A
• 発売日
  Q1/2021 Q4/2018
• Part Number
  -- SM8150