Qualcomm Snapdragon 855 对 Qualcomm Snapdragon 860. 规格、性能、测试

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 分段
  Mobile Mobile
• 系列
  Qualcomm Snapdragon Qualcomm Snapdragon
• 一代人
  6 6
• CPU组
  Qualcomm Snapdragon 855/860 Qualcomm Snapdragon 855/860
• 过去的模式
  -- Qualcomm Snapdragon 855+

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• 頻率
  1.80 GHz 1.80 GHz
• CPU核数
  8 8
• 涡轮增压 (1核)
  2.84 GHz 2.96 GHz
• CPU线程
  8 8
• Turbo (8 Cores)
  2.42 GHz 2.42 GHz
• 超线程
  没有 没有
• 超频
  没有 没有
• 核心架构
  hybrid (Prime / big.LITTLE) hybrid (Prime / big.LITTLE)
• A core
  1x Kryo 485 Prime 1x Kryo 485 Prime
• B core
  3x Kryo 485 Gold 3x Kryo 485 Gold
• C core
  4x Kryo 485 Silver 4x Kryo 485 Silver

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名称
  Qualcomm Adreno 640 Qualcomm Adreno 640
• GPU frequency
  0.25 GHz 0.25 GHz
• GPU (Turbo)
  0.59 GHz 0.68 GHz
• 执行单位
  4 4
• 着色器
  384 384
• Max. GPU Memory
  4 GB 4 GB
• Max. displays
  1 1
• 一代人
  5 5
• DirectX Version
  12.0 12.0
• 技术过程
  7 nm 7 nm
• 发布日期
  Q1/2019 Q1/2019

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• AV1
  没有 没有
• AVC
  没有 没有
• VC-1
  没有 没有
• JPEG
  没有 没有

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 860 和 Qualcomm Snapdragon 855. The supported memory frequencies may vary depending on the motherboard configuration.

• 存储器类型
  LPDDR4X-4266 LPDDR4X-2133
• 最大内存
  16 GB 16 GB
• ECC
  没有 没有
• 记忆通道
  4 4

• AES-NI
  没有 没有

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 855 和 Qualcomm Snapdragon 860 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 855 和 Qualcomm Snapdragon 860, including virtual machine technologies and fabrication processes.

• 指令集（ISA）
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• 虚拟化
  None None
• L2-Cache
  2.00 MB 2.00 MB
• L2-Cache
  3.00 MB 3.00 MB
• 建筑学
  Kryo 485 Kryo 485
• 技术过程
  7 nm 7 nm
• 插座
  N/A N/A
• 发布日期
  Q4/2018 Q1/2021
• Part Number
  SM8150 SM8150-AC