HiSilicon Kirin 990 4G versus HiSilicon Kirin 810. Especificações, desempenho, testes

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segmento
  Mobile Mobile
• Série
  HiSilicon Kirin HiSilicon Kirin
• Geração
  8 6
• Grupo CPU
  HiSilicon Kirin 990 HiSilicon Kirin 810/820

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frequência
  1.86 GHz 1.90 GHz
• Núcleos de CPU
  8 8
• Turbo (1 núcleo)
  2.09 GHz 2.20 GHz
• Roscas de CPU
  8 8
• Turbo (8 Cores)
  2.86 GHz 2.20 GHz
• Hyperthreading
  Não Não
• Overclocking
  Não Não
• Arquitectura central
  hybrid (Prime / big.LITTLE) hybrid (big.LITTLE)
• A core
  2x Cortex-A76 2x Cortex-A76
• B core
  2x Cortex-A76 6x Cortex-A55
• C core
  4x Cortex-A55 --

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nome da GPU
  ARM Mali-G76 MP16 ARM Mali-G52 MP6
• GPU frequency
  0.60 GHz 0.85 GHz
• GPU (Turbo)
  Sem turbo Sem turbo
• Unidades de execução
  16 16
• Shader
  256 288
• Max. GPU Memory
  4 GB 4 GB
• Max. displays
  2 2
• Geração
  Bifrost 3 Bifrost 2
• DirectX Version
  12 12
• Processo técnico
  7 nm 12 nm
• Data de lançamento
  Q3/2018 Q1/2018

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• AV1
  Não Não
• AVC
  Decode / Encode Decode / Encode
• VC-1
  Decode / Encode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 810 e HiSilicon Kirin 990 4G. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo de memória
  LPDDR4X-2133 LPDDR4X-2133
• Máx. Memória
  8 GB 6 GB
• ECC
  Não Não
• Canais de memória
  4 4

• AES-NI
  Não Não

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 990 4G e HiSilicon Kirin 810 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  6 W 5 W

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 990 4G e HiSilicon Kirin 810, including virtual machine technologies and fabrication processes.

• Conjunto de instruções (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualização
  None None
• Кеш L3
  2.00 MB 1.00 MB
• Arquitectura
  Cortex-A76 / Cortex-A55 Cortex-A76 / Cortex-A55
• Processo técnico
  7 nm 7 nm
• Socket
  N/A N/A
• Data de lançamento
  Q3/2019 Q2/2019