Raspberry Pi 3 B+ (Broadcom BCM2837B0) versus HiSilicon Kirin 9000. Especificações, desempenho, testes

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segmento
  Desktop / Server Mobile
• Série
  Broadcom BCM HiSilicon Kirin
• Geração
  3 9
• Grupo CPU
  Broadcom BCM2837B0 HiSilicon Kirin 9000

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frequência
  1.40 GHz 2.05 GHz
• Núcleos de CPU
  4 8
• Turbo (1 núcleo)
  Sem turbo 3.13 GHz
• Roscas de CPU
  4 8
• Hyperthreading
  Não Não
• Overclocking
  Sim Não
• Arquitectura central
  normal hybrid (Prime / big.LITTLE)
• A core
  4x Cortex-A53 1x Cortex-A77
• B core
  -- 3x Cortex-A77
• C core
  -- 4x Cortex-A55

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nome da GPU
  Broadcom VideoCore 5 ARM Mali-G78 MP24
• GPU frequency
  0.40 GHz 0.76 GHz
• GPU (Turbo)
  Sem turbo Sem turbo
• Unidades de execução
  2 24
• Shader
  24 384
• Max. GPU Memory
  1 GB --
• Max. displays
  2 1
• Geração
  5 Vallhall 2
• DirectX Version
  12
• Processo técnico
  40 nm 5 nm
• Data de lançamento
  02/2016 Q4/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Não Decode / Encode
• h265 / HEVC (10 bit)
  Não Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP9
  Não Decode / Encode
• VP8
  Decode Decode / Encode
• AV1
  Não Decode
• AVC
  Decode Decode / Encode
• VC-1
  Decode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 9000 e Raspberry Pi 3 B+ (Broadcom BCM2837B0). The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo de memória
  LPDDR2 LPDDR4X-2133LPDDR5-2750
• Máx. Memória
  1024 GB
• ECC
  Não Não
• Canais de memória
  1 4

• AES-NI
  Não Não

Analyze the TDP (Thermal Design Power) requirements of Raspberry Pi 3 B+ (Broadcom BCM2837B0) e HiSilicon Kirin 9000 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  7 W
• TDP down
  4 W --

Information on architecture, interfaces, and additional instructions supported by Raspberry Pi 3 B+ (Broadcom BCM2837B0) e HiSilicon Kirin 9000, including virtual machine technologies and fabrication processes.

• Conjunto de instruções (ISA)
  x86-64 (64 bit) ARMv8-A64 (64 bit)
• Virtualização
  None None
• Кеш L2
  0.50 MB --
• Arquitectura
  Cortex-A15 Cortex-A77 / Cortex-A55
• Processo técnico
  40 nm 5 nm
• Socket
  N/A N/A
• Data de lançamento
  02/2016 Q4/2020