Raspberry Pi 3 B+ (Broadcom BCM2837B0) contro HiSilicon Kirin 9000. Specifiche, prestazioni, test

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segmento
  Desktop / Server Mobile
• Serie
  Broadcom BCM HiSilicon Kirin
• Generazione
  3 9
• Gruppo CPU
  Broadcom BCM2837B0 HiSilicon Kirin 9000

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frequenza
  1.40 GHz 2.05 GHz
• Core della CPU
  4 8
• Turbo (1 Core)
  No turbo 3.13 GHz
• Threads della CPU
  4 8
• Hyperthreading
  No No
• Overclock
  Sì No
• Architettura di base
  normal hybrid (Prime / big.LITTLE)
• A core
  4x Cortex-A53 1x Cortex-A77
• B core
  -- 3x Cortex-A77
• C core
  -- 4x Cortex-A55

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nome della GPU
  Broadcom VideoCore 5 ARM Mali-G78 MP24
• GPU frequency
  0.40 GHz 0.76 GHz
• GPU (Turbo)
  No turbo No turbo
• Unità di esecuzione
  2 24
• Shader
  24 384
• Max. GPU Memory
  1 GB --
• Max. displays
  2 1
• Generazione
  5 Vallhall 2
• DirectX Version
  12
• Processo tecnico
  40 nm 5 nm
• Data di rilascio
  02/2016 Q4/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  No Decode / Encode
• h265 / HEVC (10 bit)
  No Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP9
  No Decode / Encode
• VP8
  Decode Decode / Encode
• AV1
  No Decode
• AVC
  Decode Decode / Encode
• VC-1
  Decode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 9000 e Raspberry Pi 3 B+ (Broadcom BCM2837B0). The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo di memoria
  LPDDR2 LPDDR4X-2133LPDDR5-2750
• Max. Memoria
  1024 GB
• ECC
  No No
• Canali di memoria
  1 4

• AES-NI
  No No

Analyze the TDP (Thermal Design Power) requirements of Raspberry Pi 3 B+ (Broadcom BCM2837B0) e HiSilicon Kirin 9000 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  7 W
• TDP down
  4 W --

Information on architecture, interfaces, and additional instructions supported by Raspberry Pi 3 B+ (Broadcom BCM2837B0) e HiSilicon Kirin 9000, including virtual machine technologies and fabrication processes.

• Set di istruzioni (ISA)
  x86-64 (64 bit) ARMv8-A64 (64 bit)
• Virtualizzazione
  None None
• L2-Cache
  0.50 MB --
• Architettura
  Cortex-A15 Cortex-A77 / Cortex-A55
• Processo tecnico
  40 nm 5 nm
• Presa
  N/A N/A
• Data di rilascio
  02/2016 Q4/2020