Raspberry Pi 3 B+ (Broadcom BCM2837B0) vs HiSilicon Kirin 9000. Specifications, performance, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Desktop / Server Mobile
• Family
  Broadcom BCM HiSilicon Kirin
• Generation
  3 9
• CPU group
  Broadcom BCM2837B0 HiSilicon Kirin 9000

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frequency
  1.40 GHz 2.05 GHz
• CPU Cores
  4 8
• Turbo (1 Core)
  No turbo 3.13 GHz
• CPU Threads
  4 8
• Hyperthreading
  No No
• Overclocking
  Yes No
• Core architecture
  normal hybrid (Prime / big.LITTLE)
• A core
  4x Cortex-A53 1x Cortex-A77
• B core
  -- 3x Cortex-A77
• C core
  -- 4x Cortex-A55

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU name
  Broadcom VideoCore 5 ARM Mali-G78 MP24
• GPU frequency
  0.40 GHz 0.76 GHz
• GPU (Turbo)
  No turbo No turbo
• Execution units
  2 24
• Shader
  24 384
• Max. GPU Memory
  1 GB --
• Max. displays
  2 1
• Generation
  5 Vallhall 2
• DirectX Version
  12
• Technology
  40 nm 5 nm
• Release date
  02/2016 Q4/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  No Decode / Encode
• h265 / HEVC (10 bit)
  No Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP9
  No Decode / Encode
• VP8
  Decode Decode / Encode
• AV1
  No Decode
• AVC
  Decode Decode / Encode
• VC-1
  Decode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 9000 and Raspberry Pi 3 B+ (Broadcom BCM2837B0). The supported memory frequencies may vary depending on the motherboard configuration.

• Memory type
  LPDDR2 LPDDR4X-2133LPDDR5-2750
• Max. Memory
  1024 GB
• ECC
  No No
• Memory channels
  1 4

• AES-NI
  No No

Analyze the TDP (Thermal Design Power) requirements of Raspberry Pi 3 B+ (Broadcom BCM2837B0) and HiSilicon Kirin 9000 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  7 W
• TDP down
  4 W --

Information on architecture, interfaces, and additional instructions supported by Raspberry Pi 3 B+ (Broadcom BCM2837B0) and HiSilicon Kirin 9000, including virtual machine technologies and fabrication processes.

• Instruction set (ISA)
  x86-64 (64 bit) ARMv8-A64 (64 bit)
• Virtualization
  None None
• L2-Cache
  0.50 MB --
• Architecture
  Cortex-A15 Cortex-A77 / Cortex-A55
• Technology
  40 nm 5 nm
• Socket
  N/A N/A
• Release date
  02/2016 Q4/2020