MediaTek Dimensity 7020 versus Qualcomm Snapdragon 888. Especificações, desempenho, testes

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Série
  Mediatek Dimensity Qualcomm Snapdragon
• Grupo CPU
  MediaTek Dimensity 7000 Qualcomm Snapdragon 888
• Segmento
  Mobile Mobile
• Geração
  1 8

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Arquitectura central
  hybrid (big.LITTLE) hybrid (Prime / big.LITTLE)
• Overclocking
  Não Não

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nome da GPU
  PowerVR IMG BXM-8-256 Qualcomm Adreno 660
• GPU frequency
  0.84 GHz
• GPU (Turbo)
  Sem turbo Sem turbo
• Geração
  11 6
• Processo técnico
  0 5 nm
• Data de lançamento
  Q1/2021

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Não Decode / Encode
• VP9
  Não Decode / Encode
• AV1
  Não Não
• AVC
  Não Decode
• VC-1
  Não Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 888 e MediaTek Dimensity 7020. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo de memória
  LPDDR4X-2133LPDDR5-3200 LPDDR4X-4266LPDDR5-3200
• Canais de memória
  4 (Quad Channel) 4
• ECC
  Não Não

Analyze the TDP (Thermal Design Power) requirements of MediaTek Dimensity 7020 e Qualcomm Snapdragon 888 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by MediaTek Dimensity 7020 e Qualcomm Snapdragon 888, including virtual machine technologies and fabrication processes.

• Processo técnico
  4 nm 5 nm
• Socket
  -- N/A
• Кеш L2
  -- 1.00 MB
• Кеш L3
  -- 8.00 MB
• Arquitectura
  Cortex-A715 / Cortex-A510 Kryo 680
• Virtualização
  None None
• Conjunto de instruções (ISA)
  ARMv9-A64 (64 bit) ARMv8-A64 (64 bit)
• Data de lançamento
  Q1/2023 Q1/2021