MediaTek Dimensity 7020 kontra Qualcomm Snapdragon 888. Specyfikacje, wydajność, testy

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Seria
  Mediatek Dimensity Qualcomm Snapdragon
• Grupa CPU
  MediaTek Dimensity 7000 Qualcomm Snapdragon 888
• Segment
  Mobile Mobile
• Pokolenie
  1 8

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Architektura podstawowa
  hybrid (big.LITTLE) hybrid (Prime / big.LITTLE)
• Overclocking
  Nie Nie

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nazwa procesora graficznego
  PowerVR IMG BXM-8-256 Qualcomm Adreno 660
• GPU frequency
  0.84 GHz
• GPU (Turbo)
  No turbo No turbo
• Pokolenie
  11 6
• Proces technologiczny
  Shadow of the Tomb Raider has a built-in benchmark, bSilnik ten obsługuje realistyczne wyświetlanie postaci i otoczenia. 5 nm
• Data wydania
  Q1/2021

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Nie Decode / Encode
• VP9
  Nie Decode / Encode
• AV1
  Nie Nie
• AVC
  Nie Decode
• VC-1
  Nie Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 888 oraz MediaTek Dimensity 7020. The supported memory frequencies may vary depending on the motherboard configuration.

• Typ pamięci
  LPDDR4X-2133LPDDR5-3200 LPDDR4X-4266LPDDR5-3200
• Kanały pamięci
  4 (Quad Channel) 4
• ECC
  Nie Nie

Analyze the TDP (Thermal Design Power) requirements of MediaTek Dimensity 7020 oraz Qualcomm Snapdragon 888 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by MediaTek Dimensity 7020 oraz Qualcomm Snapdragon 888, including virtual machine technologies and fabrication processes.

• Proces technologiczny
  4 nm 5 nm
• Gniazdo
  -- N/A
• L2-Cache
  -- 1.00 MB
• L3-Cache
  -- 8.00 MB
• Architektura
  Cortex-A715 / Cortex-A510 Kryo 680
• Wirtualizacja
  None None
• Zestaw instrukcji (ISA)
  ARMv9-A64 (64 bit) ARMv8-A64 (64 bit)
• Data wydania
  Q1/2023 Q1/2021