MediaTek Dimensity 7020 gegen Qualcomm Snapdragon 888. Spezifikationen, Leistung, Tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Serie
  Mediatek Dimensity Qualcomm Snapdragon
• CPU Gruppe
  MediaTek Dimensity 7000 Qualcomm Snapdragon 888
• Segment
  Mobile Mobile
• Generation
  1 8

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Zentrale Architektur
  hybrid (big.LITTLE) hybrid (Prime / big.LITTLE)
• Übertaktung
  Nein Nein

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU-Name
  PowerVR IMG BXM-8-256 Qualcomm Adreno 660
• GPU frequency
  0.84 GHz
• GPU (Turbo)
  kein Turbo kein Turbo
• Generation
  11 6
• technisches verfahren
  0 5 nm
• Datum der Veröffentlichung
  Q1/2021

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Nein Decode / Encode
• VP9
  Nein Decode / Encode
• AV1
  Nein Nein
• AVC
  Nein Decode
• VC-1
  Nein Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 888 und MediaTek Dimensity 7020. The supported memory frequencies may vary depending on the motherboard configuration.

• Speicher Typ
  LPDDR4X-2133LPDDR5-3200 LPDDR4X-4266LPDDR5-3200
• Speicherkanäle
  4 (Quad Channel) 4
• ECC
  Nein Nein

Analyze the TDP (Thermal Design Power) requirements of MediaTek Dimensity 7020 und Qualcomm Snapdragon 888 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by MediaTek Dimensity 7020 und Qualcomm Snapdragon 888, including virtual machine technologies and fabrication processes.

• technisches verfahren
  4 nm 5 nm
• Steckdose
  -- N/A
• L2-Cache
  -- 1.00 MB
• L3-Cache
  -- 8.00 MB
• Architektur
  Cortex-A715 / Cortex-A510 Kryo 680
• Virtualisierung
  None None
• Befehlssatz (ISA)
  ARMv9-A64 (64 bit) ARMv8-A64 (64 bit)
• Datum der Veröffentlichung
  Q1/2023 Q1/2021