HiSilicon Kirin 990 4G gegen HiSilicon Kirin 810. Spezifikationen, Leistung, Tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Serie
  HiSilicon Kirin HiSilicon Kirin
• Generation
  8 6
• CPU Gruppe
  HiSilicon Kirin 990 HiSilicon Kirin 810/820

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frequenz
  1.86 GHz 1.90 GHz
• CPU Kerne
  8 8
• Turbo (1 Kern)
  2.09 GHz 2.20 GHz
• CPU Threads
  8 8
• Turbo (8 Cores)
  2.86 GHz 2.20 GHz
• Hyperthreading
  Nein Nein
• Übertaktung
  Nein Nein
• Zentrale Architektur
  hybrid (Prime / big.LITTLE) hybrid (big.LITTLE)
• A core
  2x Cortex-A76 2x Cortex-A76
• B core
  2x Cortex-A76 6x Cortex-A55
• C core
  4x Cortex-A55 --

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU-Name
  ARM Mali-G76 MP16 ARM Mali-G52 MP6
• GPU frequency
  0.60 GHz 0.85 GHz
• GPU (Turbo)
  kein Turbo kein Turbo
• Ausführungseinheiten
  16 16
• Shader
  256 288
• Max. GPU Memory
  4 GB 4 GB
• Max. displays
  2 2
• Generation
  Bifrost 3 Bifrost 2
• DirectX Version
  12 12
• technisches verfahren
  7 nm 12 nm
• Datum der Veröffentlichung
  Q3/2018 Q1/2018

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• AV1
  Nein Nein
• AVC
  Decode / Encode Decode / Encode
• VC-1
  Decode / Encode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 810 und HiSilicon Kirin 990 4G. The supported memory frequencies may vary depending on the motherboard configuration.

• Speicher Typ
  LPDDR4X-2133 LPDDR4X-2133
• Max. Speicher
  8 GB 6 GB
• ECC
  Nein Nein
• Speicherkanäle
  4 4

• AES-NI
  Nein Nein

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 990 4G und HiSilicon Kirin 810 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  6 W 5 W

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 990 4G und HiSilicon Kirin 810, including virtual machine technologies and fabrication processes.

• Befehlssatz (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualisierung
  None None
• L3-Cache
  2.00 MB 1.00 MB
• Architektur
  Cortex-A76 / Cortex-A55 Cortex-A76 / Cortex-A55
• technisches verfahren
  7 nm 7 nm
• Steckdose
  N/A N/A
• Datum der Veröffentlichung
  Q3/2019 Q2/2019