Samsung Exynos 7420 kontra HiSilicon Kirin 960. Specyfikacje, wydajność, testy

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Seria
  Samsung Exynos HiSilicon Kirin
• Grupa CPU
  Samsung Exynos 7420 HiSilicon Kirin 960
• Segment
  Mobile Mobile
• Pokolenie
  1 5

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Architektura podstawowa
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• Częstotliwość
  1.50 GHz 1.80 GHz
• Turbo (1 rdzeń)
  2.10 GHz 2.40 GHz
• Turbo (8 Cores)
  2.10 GHz 2.40 GHz
• Hyperthreading
  Nie Nie
• Overclocking
  Nie Nie

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nazwa procesora graficznego
  ARM Mali-T760 MP8 ARM Mali-G71 MP8
• GPU frequency
  0.70 GHz 0.90 GHz
• GPU (Turbo)
  0.77 GHz No turbo
• Jednostki wykonawcze
  8 8
• Shader
  128 256
• Max. GPU Memory
  -- 2 GB
• Max. displays
  2 2
• Pokolenie
  Midgard 3 Bifrost 1
• Proces technologiczny
  28nm 16 nm
• Data wydania
  Q4/2013 Q2/2016

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Nie Decode / Encode
• h265 / HEVC (10 bit)
  Nie Decode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Nie Nie
• AV1
  Nie Nie
• AVC
  Nie Decode / Encode
• VC-1
  Nie Nie
• JPEG
  Nie Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 960 oraz Samsung Exynos 7420. The supported memory frequencies may vary depending on the motherboard configuration.

• Typ pamięci
  LPDDR4-1600 LPDDR4-1600
• Max. Pamięć
  6 GB
• Kanały pamięci
  Shadow of the Tomb Raider has a built-in benchmark, bSilnik ten obsługuje realistyczne wyświetlanie postaci i otoczenia. 2
• ECC
  Nie Nie

Analyze the TDP (Thermal Design Power) requirements of Samsung Exynos 7420 oraz HiSilicon Kirin 960 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  5 W

Information on architecture, interfaces, and additional instructions supported by Samsung Exynos 7420 oraz HiSilicon Kirin 960, including virtual machine technologies and fabrication processes.

• Zestaw instrukcji (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L2-Cache
  0.51 MB --
• L3-Cache
  -- 4.00 MB
• Architektura
  Cortex-A57 / Cortex-A53 Cortex-A73 / Cortex-A53
• Proces technologiczny
  14 nm 16 nm
• Wirtualizacja
  None None
• Gniazdo
  N/A N/A
• Data wydania
  Q2/2015 Q4/2016