Qualcomm Snapdragon 835 kontra Qualcomm Snapdragon 670. Specyfikacje, wydajność, testy

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Seria
  Qualcomm Snapdragon Qualcomm Snapdragon
• Pokolenie
  4 6
• Grupa CPU
  Qualcomm Snapdragon 830 Qualcomm Snapdragon 670

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Częstotliwość
  1.90 GHz 1.70 GHz
• Rdzenie CPU
  8 8
• Turbo (1 rdzeń)
  2.45 GHz 2.00 GHz
• CPU Threads
  8 8
• Turbo (8 Cores)
  2.45 GHz 1.70 GHz
• Hyperthreading
  Nie Nie
• Overclocking
  Nie Nie
• Architektura podstawowa
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A core
  4x Kryo 280 Gold 2x Kryo 360 Gold
• B core
  4x Kryo 280 Silver 6x Kryo 360 Silver

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nazwa procesora graficznego
  Qualcomm Adreno 540 Qualcomm Adreno 615
• GPU frequency
  0.71 GHz 0.70 GHz
• GPU (Turbo)
  0.71 GHz 0.70 GHz
• Shader
  384 256
• Pokolenie
  5 6
• DirectX Version
  11.1 12.1
• Proces technologiczny
  10 nm 10 nm
• Data wydania
  Q1/2017 Q2/2018

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode
• h265 / HEVC (10 bit)
  Nie Decode
• h264
  Decode Decode
• VP9
  Decode Decode
• VP8
  Decode Decode
• AV1
  Nie Nie
• AVC
  Nie Decode
• VC-1
  Decode Decode
• JPEG
  Decode Decode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 670 oraz Qualcomm Snapdragon 835. The supported memory frequencies may vary depending on the motherboard configuration.

• Typ pamięci
  LPDDR4X-1866 LPDDR4X-1866
• ECC
  Nie Nie
• Kanały pamięci
  2 2

• AES-NI
  Nie Nie

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 835 oraz Qualcomm Snapdragon 670 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 835 oraz Qualcomm Snapdragon 670, including virtual machine technologies and fabrication processes.

• Zestaw instrukcji (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Wirtualizacja
  None None
• Architektura
  Kryo 280 Kryo 360
• Proces technologiczny
  10 nm 10 nm
• Gniazdo
  N/A N/A
• Data wydania
  Q2/2017 Q3/2018
• Part Number
  MSM8998 SDM670