Qualcomm Snapdragon 835 vs Qualcomm Snapdragon 670. 사양, 성능, 테스트

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 세그먼트
  Mobile Mobile
• 가족
  Qualcomm Snapdragon Qualcomm Snapdragon
• 세대
  4 6
• CPU 그룹
  Qualcomm Snapdragon 830 Qualcomm Snapdragon 670

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• 빈도
  1.90 GHz 1.70 GHz
• CPU 코어
  8 8
• Turbo (1 Core)
  2.45 GHz 2.00 GHz
• CPU 스레드
  8 8
• Turbo (8 Cores)
  2.45 GHz 1.70 GHz
• Hyperthreading
  아니요 아니요
• 오버클러킹
  아니요 아니요
• 핵심 아키텍처
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A core
  4x Kryo 280 Gold 2x Kryo 360 Gold
• B core
  4x Kryo 280 Silver 6x Kryo 360 Silver

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU 이름
  Qualcomm Adreno 540 Qualcomm Adreno 615
• GPU frequency
  0.71 GHz 0.70 GHz
• GPU (Turbo)
  0.71 GHz 0.70 GHz
• Shader
  384 256
• 세대
  5 6
• DirectX Version
  11.1 12.1
• 기술
  10 nm 10 nm
• 릴리스 날짜
  Q1/2017 Q2/2018

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode
• h265 / HEVC (10 bit)
  아니요 Decode
• h264
  Decode Decode
• VP9
  Decode Decode
• VP8
  Decode Decode
• AV1
  아니요 아니요
• AVC
  아니요 Decode
• VC-1
  Decode Decode
• JPEG
  Decode Decode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 670 그리고 Qualcomm Snapdragon 835. The supported memory frequencies may vary depending on the motherboard configuration.

• 메모리 유형
  LPDDR4X-1866 LPDDR4X-1866
• ECC
  아니요 아니요
• 메모리 채널
  2 2

• AES-NI
  아니요 아니요

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 835 그리고 Qualcomm Snapdragon 670 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 835 그리고 Qualcomm Snapdragon 670, including virtual machine technologies and fabrication processes.

• 명령어 세트(ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• 가상화
  None None
• 아키텍처
  Kryo 280 Kryo 360
• 기술
  10 nm 10 nm
• 소켓
  N/A N/A
• 릴리스 날짜
  Q2/2017 Q3/2018
• Part Number
  MSM8998 SDM670