Qualcomm Snapdragon 835 contra Qualcomm Snapdragon 670. Especificaciones, rendimiento, pruebas

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segmento
  Mobile Mobile
• Serie
  Qualcomm Snapdragon Qualcomm Snapdragon
• Generación
  4 6
• Grupo CPU
  Qualcomm Snapdragon 830 Qualcomm Snapdragon 670

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frecuencia
  1.90 GHz 1.70 GHz
• Núcleos de CPU
  8 8
• Turbo (1 núcleo)
  2.45 GHz 2.00 GHz
• Hilos de la CPU
  8 8
• Turbo (8 Cores)
  2.45 GHz 1.70 GHz
• Hyperthreading
  No No
• Overclocking
  No No
• Arquitectura del núcleo
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A core
  4x Kryo 280 Gold 2x Kryo 360 Gold
• B core
  4x Kryo 280 Silver 6x Kryo 360 Silver

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nombre de la GPU
  Qualcomm Adreno 540 Qualcomm Adreno 615
• GPU frequency
  0.71 GHz 0.70 GHz
• GPU (Turbo)
  0.71 GHz 0.70 GHz
• Shader
  384 256
• Generación
  5 6
• DirectX Version
  11.1 12.1
• Proceso técnico
  10 nm 10 nm
• Fecha de publicación
  Q1/2017 Q2/2018

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode
• h265 / HEVC (10 bit)
  No Decode
• h264
  Decode Decode
• VP9
  Decode Decode
• VP8
  Decode Decode
• AV1
  No No
• AVC
  No Decode
• VC-1
  Decode Decode
• JPEG
  Decode Decode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 670 y Qualcomm Snapdragon 835. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo de memoria
  LPDDR4X-1866 LPDDR4X-1866
• ECC
  No No
• Canales de memoria
  2 2

• AES-NI
  No No

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 835 y Qualcomm Snapdragon 670 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 835 y Qualcomm Snapdragon 670, including virtual machine technologies and fabrication processes.

• Juego de instrucciones (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualización
  None None
• Arquitectura
  Kryo 280 Kryo 360
• Proceso técnico
  10 nm 10 nm
• Enchufe
  N/A N/A
• Fecha de publicación
  Q2/2017 Q3/2018
• Part Number
  MSM8998 SDM670