AMD Ryzen Embedded V1807B kontra AMD Sempron 2650. Specyfikacje, wydajność, testy

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Desktop / Server Desktop / Server
• Seria
  AMD Ryzen Embedded AMD Sempron
• Pokolenie
  1 1
• Grupa CPU
  AMD Ryzen Embedded V1000 AMD Sempron 2000/3000

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Częstotliwość
  3.35 GHz 1.45 GHz
• Rdzenie CPU
  4 2
• Turbo (1 rdzeń)
  3.80 GHz No turbo
• CPU Threads
  8 2
• Hyperthreading
  Tak Nie
• Overclocking
  Nie Tak
• Architektura podstawowa
  normal normal

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nazwa procesora graficznego
  AMD Radeon Vega 11 Graphics AMD Radeon HD 8240
• GPU frequency
  1.30 GHz 0.40 GHz
• GPU (Turbo)
  No turbo No turbo
• Jednostki wykonawcze
  11 2
• Shader
  704 128
• Max. GPU Memory
  2 GB 2 GB
• Max. displays
  3 2
• Pokolenie
  8 5
• DirectX Version
  12 11.1
• Proces technologiczny
  14 nm 28 nm
• Data wydania
  Q1/2018 Q2/2013

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Nie
• h265 / HEVC (10 bit)
  Decode / Encode Nie
• h264
  Decode / Encode Decode
• VP9
  Decode / Encode Nie
• VP8
  Decode / Encode Nie
• AV1
  Nie Nie
• AVC
  Decode / Encode Decode
• VC-1
  Decode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by AMD Sempron 2650 oraz AMD Ryzen Embedded V1807B. The supported memory frequencies may vary depending on the motherboard configuration.

• Typ pamięci
  DDR4-3200 DDR3L-1333 SO-DIMM
• Max. Pamięć
  32 GB
• ECC
  Tak Nie
• Kanały pamięci
  2 1
• Wersja PCIe
  3.0
• Pasma PCIe
  16

• AES-NI
  Tak Tak

Analyze the TDP (Thermal Design Power) requirements of AMD Ryzen Embedded V1807B oraz AMD Sempron 2650 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  45 W 25 W
• TDP up
  54 W --
• TDP down
  35 W --
• Temperatura maksymalna
  105 °C --

Information on architecture, interfaces, and additional instructions supported by AMD Ryzen Embedded V1807B oraz AMD Sempron 2650, including virtual machine technologies and fabrication processes.

• Zestaw instrukcji (ISA)
  x86-64 (64 bit) x86-64 (64 bit)
• Wirtualizacja
  AMD-V, SVM AMD-V
• Rozszerzenia ISA
  SSE4a, SSE4.1, SSE4.2, AVX2, FMA3 SSE4a, SSE4.1, SSE4.2, AVX
• L3-Cache
  4.00 MB 1.00 MB
• Architektura
  Great Horned Owl (Zen) Kabini (Jaguar)
• Proces technologiczny
  14 nm 28 nm
• Gniazdo
  FP5 AM1
• Data wydania
  Q1/2018 Q2/2014