AMD Ryzen Embedded V1807B contre AMD Sempron 2650. Spécifications, performances, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Desktop / Server Desktop / Server
• Série
  AMD Ryzen Embedded AMD Sempron
• Génération
  1 1
• Groupe de CPU
  AMD Ryzen Embedded V1000 AMD Sempron 2000/3000

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Fréquence
  3.35 GHz 1.45 GHz
• Cœurs de CPU
  4 2
• Turbo (1 cœur)
  3.80 GHz Pas de turbo
• Fils de processeur
  8 2
• Hyperthreading
  Oui Non
• Overclocking
  Non Oui
• Architecture de base
  normal normal

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nom du GPU
  AMD Radeon Vega 11 Graphics AMD Radeon HD 8240
• GPU frequency
  1.30 GHz 0.40 GHz
• GPU (Turbo)
  Pas de turbo Pas de turbo
• Unités d'exécution
  11 2
• Shader
  704 128
• Max. GPU Memory
  2 GB 2 GB
• Max. displays
  3 2
• Génération
  8 5
• DirectX Version
  12 11.1
• Processus technologique
  14 nm 28 nm
• Date de sortie
  Q1/2018 Q2/2013

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Non
• h265 / HEVC (10 bit)
  Decode / Encode Non
• h264
  Decode / Encode Decode
• VP9
  Decode / Encode Non
• VP8
  Decode / Encode Non
• AV1
  Non Non
• AVC
  Decode / Encode Decode
• VC-1
  Decode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by AMD Sempron 2650 et AMD Ryzen Embedded V1807B. The supported memory frequencies may vary depending on the motherboard configuration.

• Type de mémoire
  DDR4-3200 DDR3L-1333 SO-DIMM
• Max. Mémoire
  32 GB
• ECC
  Oui Non
• Canaux de mémoire
  2 1
• Version PCIe
  3.0
• Couloirs PCIe
  16

• AES-NI
  Oui Oui

Analyze the TDP (Thermal Design Power) requirements of AMD Ryzen Embedded V1807B et AMD Sempron 2650 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  45 W 25 W
• TDP up
  54 W --
• TDP down
  35 W --
• Température maximale
  105 °C --

Information on architecture, interfaces, and additional instructions supported by AMD Ryzen Embedded V1807B et AMD Sempron 2650, including virtual machine technologies and fabrication processes.

• Jeu d'instructions (ISA)
  x86-64 (64 bit) x86-64 (64 bit)
• Virtualization
  AMD-V, SVM AMD-V
• Extensions ISA
  SSE4a, SSE4.1, SSE4.2, AVX2, FMA3 SSE4a, SSE4.1, SSE4.2, AVX
• L3-Cache
  4.00 MB 1.00 MB
• Architecture
  Great Horned Owl (Zen) Kabini (Jaguar)
• Processus technologique
  14 nm 28 nm
• Socket
  FP5 AM1
• Date de sortie
  Q1/2018 Q2/2014