AMD Ryzen Embedded V1807B contra AMD Sempron 2650. Especificaciones, rendimiento, pruebas

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segmento
  Desktop / Server Desktop / Server
• Serie
  AMD Ryzen Embedded AMD Sempron
• Generación
  1 1
• Grupo CPU
  AMD Ryzen Embedded V1000 AMD Sempron 2000/3000

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frecuencia
  3.35 GHz 1.45 GHz
• Núcleos de CPU
  4 2
• Turbo (1 núcleo)
  3.80 GHz sin turbo
• Hilos de la CPU
  8 2
• Hyperthreading
  Sí No
• Overclocking
  No Sí
• Arquitectura del núcleo
  normal normal

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nombre de la GPU
  AMD Radeon Vega 11 Graphics AMD Radeon HD 8240
• GPU frequency
  1.30 GHz 0.40 GHz
• GPU (Turbo)
  sin turbo sin turbo
• Unidades de ejecución
  11 2
• Shader
  704 128
• Max. GPU Memory
  2 GB 2 GB
• Max. displays
  3 2
• Generación
  8 5
• DirectX Version
  12 11.1
• Proceso técnico
  14 nm 28 nm
• Fecha de publicación
  Q1/2018 Q2/2013

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode No
• h265 / HEVC (10 bit)
  Decode / Encode No
• h264
  Decode / Encode Decode
• VP9
  Decode / Encode No
• VP8
  Decode / Encode No
• AV1
  No No
• AVC
  Decode / Encode Decode
• VC-1
  Decode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by AMD Sempron 2650 y AMD Ryzen Embedded V1807B. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo de memoria
  DDR4-3200 DDR3L-1333 SO-DIMM
• Max. Memoria
  32 GB
• ECC
  Sí No
• Canales de memoria
  2 1
• Versión PCIe
  3.0
• Carriles PCIe
  16

• AES-NI
  Sí Sí

Analyze the TDP (Thermal Design Power) requirements of AMD Ryzen Embedded V1807B y AMD Sempron 2650 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  45 W 25 W
• TDP up
  54 W --
• TDP down
  35 W --
• Temperatura máxima
  105 °C --

Information on architecture, interfaces, and additional instructions supported by AMD Ryzen Embedded V1807B y AMD Sempron 2650, including virtual machine technologies and fabrication processes.

• Juego de instrucciones (ISA)
  x86-64 (64 bit) x86-64 (64 bit)
• Virtualización
  AMD-V, SVM AMD-V
• Extensiones ISA
  SSE4a, SSE4.1, SSE4.2, AVX2, FMA3 SSE4a, SSE4.1, SSE4.2, AVX
• L3-Cache
  4.00 MB 1.00 MB
• Arquitectura
  Great Horned Owl (Zen) Kabini (Jaguar)
• Proceso técnico
  14 nm 28 nm
• Enchufe
  FP5 AM1
• Fecha de publicación
  Q1/2018 Q2/2014